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公开(公告)号：US20240355549A1
公开(公告)日：2024-10-24
申请号：US18603754
申请日：2024-03-13
发明人： Ye Rin HONG , Kyong Nam HWANG , Jong Suk JEONG , Yang-Seok PARK , Hye Mi YOO , Seung Min LEE
CPC分类号： H01G4/30 , H01G4/012 , H01G4/1227 , H01G4/2325
摘要： A multilayer electronic component includes a body including a dielectric layer and internal electrodes disposed alternately with the dielectric layer in a first direction; a first side margin portion and a second side margin portion disposed on opposing side surfaces of the body; a first external electrode and a second external electrode disposed on opposing end surfaces of the body. When an average size of the first side margin portion is defined as W1, an average size of the second side margin portion is defined as W2, and an average size between external surfaces of the first and second side margin portions is defined as W0, (W1+W2)/W0 td is satisfied.
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公开(公告)号：US20240339266A1
公开(公告)日：2024-10-10
申请号：US18442627
申请日：2024-02-15
发明人： Chaedong Lee , Seung Ah Kim , Gyuho Yeon , Byungjun Jeon
CPC分类号： H01G4/2325 , H01G4/30
摘要： A multilayer capacitor: includes a capacitor body including a first internal electrode and a second internal electrode stacked with a dielectric layer interposed therebetween, the capacitor body having a first surface and a second surface opposite each other and a third surface extending between the first and second surfaces; and an external electrode including a connection portion disposed at the third surface, and a band portion extending from the connection portion to the first surface and the second surface. The external electrode includes a base electrode in contact with the capacitor body, and a conductive resin layer disposed to cover the base electrode at least partially. A thickness of the conductive resin layer at an end part of the base electrode on the first surface and a thickness of the conductive resin layer at an end part of the base electrode on the second surface are different from each other.
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公开(公告)号：US20240331945A1
公开(公告)日：2024-10-03
申请号：US18617235
申请日：2024-03-26
发明人： Takashi ASAI , Yoichi KATO , Tomoyasu EGUCHI
CPC分类号： H01G4/2325 , H01G4/30
摘要： A multilayer ceramic electronic device includes an element body and external electrodes. At least one of the pair of external electrodes includes a first metal layer and a second metal layer. The first metal layer covers a part of internal electrodes and a first portion of cover dielectric layers and side margin sections which is located on a side of the internal electrodes, does not cover a second portion of the cover dielectric layers and the side margin section which is other than the first portion, contacts a part of the internal electrodes, and has a main component of nickel or copper, at a corresponding end face of the element body. The second metal layer covers the first metal layer, contacts at least a part of the second portion on a side of the first metal layer, and has a main component of tin.
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公开(公告)号：US12100555B2
公开(公告)日：2024-09-24
申请号：US18237505
申请日：2023-08-24
发明人： Yoshiyuki Abe , Kazuhisa Uchida
CPC分类号： H01G4/1227 , H01G4/0085 , H01G4/2325 , H01G4/30
摘要： A multilayer ceramic capacitor includes first dielectric ceramic layers each with a thickness of about 0.48 μm or more and about 0.50 μm or less in the lamination direction, and additional dielectric ceramic layers each with a thickness of about 10 μm or more and about 15 μm or less in the width direction. A number of dielectric particles in each first dielectric ceramic layer in a thickness direction is three or more and six or less. A number of dielectric particles in each additional dielectric ceramic layer in a thickness direction is 100 or more and 150 or less. When the number of dielectric particles in each of first dielectric ceramic layer is NT, and the number of dielectric particles in each additional dielectric ceramic layer is NW, a ratio of NT to NW is about 1:23.08 or more and about 1:46.15 or less.
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公开(公告)号：US20240312718A1
公开(公告)日：2024-09-19
申请号：US18583094
申请日：2024-02-21
发明人： So Jung AN , Hyung Jong CHOI , Jung Won PARK , Yoo Jeong LEE , Kwang Yeun WON , Woo Kyung SUNG , Byung Jun JEON , Chul Seung LEE
CPC分类号： H01G4/30 , H01G4/008 , H01G4/012 , H01G4/12 , H01G4/2325
摘要： A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein the external electrode includes an electrode layer connected to the internal electrode and including Cu, a first plating portion disposed on the electrode layer, and a second plating portion disposed on the first plating portion, and wherein the first plating portion includes a Ni layer in contact with the electrode layer, and an intermetallic compound layer disposed on the Ni layer and including an intermetallic compound including at least one of Ni and Sn.
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公开(公告)号：US20240312714A1
公开(公告)日：2024-09-19
申请号：US18222087
申请日：2023-07-14
发明人： Chung Yeol Lee , Cheong Kim , Jong Rock Lee , Jun Il Kang , Hiroki Okada , Hee Jung Jung
CPC分类号： H01G4/2325 , H01G4/30
摘要： A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including a base electrode layer disposed on the body and including a first metal element, and an alloy layer and a plating layer, sequentially disposed on the base electrode layer. The alloy layer includes a first alloy layer disposed to contact the base electrode layer and including an alloy of the first metal element and Sn, and a second alloy layer disposed to contact the first alloy layer and including an alloy of Ni and Sn, and the plating layer includes an Ni plating layer disposed to contact the second alloy layer.
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公开(公告)号：US20240296996A1
公开(公告)日：2024-09-05
申请号：US18210936
申请日：2023-06-16
发明人： Kwang Dong Seong , Young Ah Song , Bong Gyu Choi , Do Kyeong Lee , Jae Hoon Bang , Wan Sik Kim
CPC分类号： H01G4/30 , H01G4/008 , H01G4/012 , H01G4/12 , H01G4/2325
摘要： A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode, wherein the external electrode includes a conductive metal and glass, and wherein at least a portion of the glass includes a secondary phase of the glass including barium (Ba), aluminum (Al), and silicon (Si).
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公开(公告)号：US20240290540A1
公开(公告)日：2024-08-29
申请号：US18437561
申请日：2024-02-09
发明人： Hyung Duk Yun , Byung Jun Jeon , Chae Min Park , Yong Won Seo , Ho In Jun , A Ra Cho
CPC分类号： H01G4/0085 , H01G4/2325 , H01G4/30
摘要： Provided is a multilayer electronic component according to an example embodiment of the present disclosure including: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, and including Ni; and an external electrode disposed on the body and connected to the internal electrode, wherein the external electrode includes a base electrode layer including Ni and Pd, and the internal electrode includes a first region, and a content of Pd included in the first region is greater than a content of Pd included in a remaining region, excluding the first region in the internal electrode.
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公开(公告)号：US20240282529A1
公开(公告)日：2024-08-22
申请号：US18224669
申请日：2023-07-21
发明人： Young Ah SONG , Bong Gyu CHOI , Kwang Dong SEONG , Jae Hoon BANG , Do Kyeong LEE , Wan Sik KIM
CPC分类号： H01G4/2325 , H01G4/248 , H01G4/30
摘要： Provided is a multilayer electronic component, the multilayer electronic component including: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; an external electrode disposed on the body and connected to the internal electrodes, wherein the external electrode includes a metal including Cu, wherein the metal included in the external electrode has crystallites having a size of 70 nm or more and 100 nm or less, measured from a peak of a plane obtained from an X-ray diffraction pattern.
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公开(公告)号：US20240274360A1
公开(公告)日：2024-08-15
申请号：US18387326
申请日：2023-11-06
发明人： Soohwan SON , Youngghyu AHN
CPC分类号： H01G4/2325 , H01G4/30
摘要： A multilayered capacitor includes a capacitor body including a dielectric layer and an internal electrode, and an external electrode disposed outside the capacitor body, wherein the external electrode includes a first layer connected to the internal electrode, and a second layer covering at least a portion of the first layer, and the second layer includes resin and conductive polymer particles.
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