公开(公告)号：US20210403702A1

公开(公告)日：2021-12-30

申请号：US17473600

申请日：2021-09-13

Applicant: NHK SPRING CO., LTD.

Inventor： Katsumi Mizuno ,  Asuka Kawasaki

IPC: C08L63/00 ,  C08G59/50 ,  C08K3/013 ,  H05K1/03 ,  H05K1/05

Abstract: According to an embodiment, a thermosetting epoxy resin composition including an epoxy resin, an aromatic amine compound, a boron-phosphorus complex, and a phosphorus compound is provided. The aromatic amine compound is represented by the following general formula (1) (where R1 represents an alkyl group, m represents an integer of 2 or more, n represents an integer of 0 or more, and m and n satisfy m+n≤6, and when n is an integer of 2 or more, a plurality of R1 may be the same as or different from each other).

公开(公告)号：US11490513B2

公开(公告)日：2022-11-01

申请号：US15666540

申请日：2017-08-01

Applicant: NHK SPRING CO., LTD.

Inventor： Katsumi Mizuno ,  Daiki Ikeda

IPC: H05K1/05 ,  H05K1/02 ,  H05K3/30 ,  H05K3/44 ,  H05K3/20 ,  H05K1/03 ,  H05K3/10

Abstract: According to one embodiment, a metal base circuit board includes a metal base substrate, a first circuit pattern, and a first insulating layer between the metal base substrate and the first circuit pattern. The first insulating layer covers a lower surface of the first circuit pattern and at least part of a side surface of the first circuit pattern, the lower surface facing the metal base substrate, the at least part of the side surface being adjacent to the lower surface.