公开(公告)号：US20230244020A1

公开(公告)日：2023-08-03

申请号：US17766453

申请日：2020-10-05

Applicant: NITTO DENKO CORPORATION

Inventor： Takanobu YANO ,  Shou TAKARADA ,  Takeshi NAKANO ,  Koji SHITARA ,  Yoshitaka SUGITA ,  Kazutaka MINOURA

IPC: G02B5/30 ,  H10K59/40 ,  G02B1/14 ,  H10K59/80

CPC classification number: G02B5/305 ,  H10K59/40 ,  G02B1/14 ,  G02B5/3083 ,  H10K59/8793 ,  H10K59/873

Abstract: The multilayer structure used to be deformed by bending with a first member outside, includes the first member, a first adhesive layer, a second member having one surface joined to one surface of the first member at least via the first adhesive layer, a second adhesive layer, and a first structure having one surface joined to the other surface of the second member at least via the second adhesive layer. The first structure includes a third member on a surface in contact with the second adhesive layer, including, on a surface in contact with the second adhesive layer, a layer that is likely to be broken when deformed. Hardness of each of the first and second adhesive layer is determined such that when the multilayer structure is deformed, the extension of the layer likely to be broken is reduced to a value lower than the tensile breaking extension thereof.