公开(公告)号：US09909930B2

公开(公告)日：2018-03-06

申请号：US14630050

申请日：2015-02-24

Applicant: NXP B.V.

Inventor： Zoran Zivkovic ,  Kim Phan Le ,  Hilco Suy

IPC: G01K1/02 ,  G01K3/08 ,  G01K7/00 ,  H05K1/00 ,  H05K3/00 ,  G01K7/16 ,  G01K7/42 ,  H05K1/02

CPC classification number: G01K7/16 ,  G01K3/08 ,  G01K7/427 ,  H04M17/026 ,  H04M2250/12 ,  H05K1/0201 ,  H05K2201/10151

Abstract: One example discloses a multi-sensor assembly, comprising: a first temperature sensor, having a first thermal profile; a second temperature sensor, having a second thermal profile different from the first thermal profile; wherein the first and second temperature sensors are mounted on a set of lead-frames; wherein the first and second temperature sensors include a first heat path input coupled to an ambient environment, and a second heat path input coupled to at least one of the lead-frames; and wherein the first and second sensors and set of lead-frames are included in a single multi-sensor assembly. Another example discloses a method of manufacture for the multi-sensor assembly.

公开(公告)号：US20160245706A1

公开(公告)日：2016-08-25

申请号：US14630050

申请日：2015-02-24

Applicant: NXP B.V.

Inventor： Zoran Zivkovic ,  Kim Phan Le ,  Hilco Suy

IPC: G01K7/16 ,  G01K3/08

CPC classification number: G01K7/16 ,  G01K3/08 ,  G01K7/427 ,  H04M17/026 ,  H04M2250/12 ,  H05K1/0201 ,  H05K2201/10151

Abstract: One example discloses a multi-sensor assembly, comprising: a first temperature sensor, having a first thermal profile; a second temperature sensor, having a second thermal profile different from the first thermal profile; wherein the first and second temperature sensors are mounted on a set of lead-frames; wherein the first and second temperature sensors include a first heat path input coupled to an ambient environment, and a second heat path input coupled to at least one of the lead-frames; and wherein the first and second sensors and set of lead-frames are included in a single multi-sensor assembly. Another example discloses a method of manufacture for the multi-sensor assembly.

Abstract translation: 一个实例公开了一种多传感器组件，包括：具有第一热分布的第一温度传感器; 第二温度传感器，具有不同于第一热分布的第二热分布; 其中所述第一温度传感器和所述第二温度传感器安装在一组引线框架上; 其中所述第一和第二温度传感器包括耦合到周围环境的第一热路输入和耦合到所述引线框架中的至少一个的第二热路输入; 并且其中所述第一和第二传感器和引线框组被包括在单个多传感器组件中。 另一个实例公开了一种用于多传感器组件的制造方法。

公开(公告)号：US20130102085A1

公开(公告)日：2013-04-25

申请号：US13644668

申请日：2012-10-04

Applicant: NXP B.V.

Inventor： Hilco Suy ,  Filip FREDERIX ,  David VAN STEENWINCKEL ,  Romano HOOFMAN

IPC: G01N27/00

CPC classification number: C12Q1/6816 ,  G01N33/5438 ,  C12Q2565/607

Abstract: A semiconductor chip, apparatus, and associated method wherein the semiconductor chip, having at least one electrode and configured as a sensor such as a biosensor, is removably attachable to a tip of a dipstick. The dipstick tip, with the attached semiconductor chip, is arranged to be dipped into a well containing an analyte. The well may be part of a micro-titre plate. The chip electrically senses the presence of a target molecule in the analyte. The sensing may be by detecting a change in capacitance associated with the electrode which occurs in the presence of the target molecule. The apparatus may include plural dipsticks and associated semiconductor chips which are sensitive for different target molecules. Alternatively or in addition, a single semiconductor chip may have a plurality of electrodes, which may be sensitive to different target molecules.

Abstract translation: 半导体芯片，装置和相关方法，其中具有至少一个电极并被配置为诸如生物传感器的传感器的半导体芯片可移除地附接到量油尺的尖端。 配有附着的半导体芯片的量尺贴片被布置成浸入含有分析物的阱中。 井可能是微滴定板的一部分。 芯片电感测分析物中目标分子的存在。 感测可以通过检测在靶分子的存在下发生的与电极相关的电容的变化。 该装置可以包括对不同目标分子敏感的多个骰子和相关联的半导体芯片。 或者或另外，单个半导体芯片可以具有多个可能对不同靶分子敏感的电极。