公开(公告)号：US12199333B2

公开(公告)日：2025-01-14

申请号：US17649725

申请日：2022-02-02

Applicant: NXP B.V.

Inventor： Antonius Hendrikus Jozef Kamphuis ,  Jan Willem Bergman ,  Marcellinus Johannes Maria Geurts ,  Mustafa Acar ,  Paul Mattheijssen ,  Rajesh Mandamparambil ,  Andrei-Alexandru Damian ,  Amar Ashok Mavinkurve

IPC: H01Q1/22 ,  H01L23/60 ,  H01L25/00 ,  H01L25/065 ,  H01Q9/04

Abstract: A semiconductor device comprising a substrate, a first integrated circuit package mounted on the substrate, the first integrated circuit package comprising a first antenna sub-array having a uniform pitch, and a second integrated circuit package mounted on the substrate, the second integrated circuit package comprising a second antenna sub-array having a uniform pitch. The second integrated circuit package is mounted adjacent to the first integrated circuit package to form a multi-package module having an antenna array formed of the first antenna sub-array and the second antenna sub-array, wherein the antenna array has a uniform pitch. Also provided is a method of manufacturing a multi-package module and a method of providing package-to-package grounding.

公开(公告)号：US10593635B2

公开(公告)日：2020-03-17

申请号：US15937278

申请日：2018-03-27

Applicant: NXP B.V.

Inventor： Antonius Hendrikus Jozef Kamphuis ,  Paul Southworth ,  Keith Richard Sarault ,  Marcellinus Johannes Maria Geurts ,  Jeroen Johannes Maria Zaal ,  Johannes Henricus Johanna Janssen ,  Amar Ashok Mavinkurve

IPC: H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/427 ,  H01L23/538 ,  H01L23/00 ,  H01P5/16 ,  H01Q1/22 ,  H01Q21/00 ,  H01Q1/52 ,  H01L23/522

Abstract: Embodiments are provided for a multi-die packaged semiconductor device including: a panel of embedded dies including a plurality of radio frequency (RF) dies, wherein each RF die includes RF front-end circuitry, each RF die has an active side that includes a plurality of pads, each RF die has a back side exposed in a back side of the panel; a plurality of antenna connectors formed on a subset of the plurality of pads of each RF die; and an array of antennas formed over a front side of the panel and connected to the plurality of antenna connectors.

公开(公告)号：US20220263222A1

公开(公告)日：2022-08-18

申请号：US17649725

申请日：2022-02-02

Applicant: NXP B.V.

Inventor： Antonius Hendrikus Jozef Kamphuis ,  Jan Willem Bergman ,  Marcellinus Johannes Maria Geurts ,  Mustafa Acar ,  Paul Mattheijssen ,  Rajesh Mandamparambil ,  Andrei-Alexandru Damian ,  Amar Ashok Mavinkurve

IPC: H01Q1/22 ,  H01Q9/04 ,  H01L25/065 ,  H01L23/60 ,  H01L25/00

Abstract: A semiconductor device comprising a substrate, a first integrated circuit package mounted on the substrate, the first integrated circuit package comprising a first antenna sub-array having a uniform pitch, and a second integrated circuit package mounted on the substrate, the second integrated circuit package comprising a second antenna sub-array having a uniform pitch. The second integrated circuit package is mounted adjacent to the first integrated circuit package to form a multi-package module having an antenna array formed of the first antenna sub-array and the second antenna sub-array, wherein the antenna array has a uniform pitch. Also provided is a method of manufacturing a multi-package module and a method of providing package-to-package grounding.