公开(公告)号：US10431575B2

公开(公告)日：2019-10-01

申请号：US15846425

申请日：2017-12-19

Applicant: NXP B.V.

Inventor： Antonius Hendrikus Jozef Kamphuis ,  Jeroen Johannes Maria Zaal ,  Johannes Henricus Johanna Janssen ,  Amar Ashok Mavinkurve

IPC: H01L25/00 ,  H01L21/66 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L23/00 ,  H01L23/538 ,  H01L25/18 ,  H04B1/40 ,  H01L23/367 ,  H01L23/427 ,  H04B1/04 ,  H04B1/16

Abstract: Embodiments are provided that include a method for fabricating a multi-die package including: placing a plurality of flip chip dies and splitter dies on the sacrificial carrier; performing solder reflow to join solder bumps of each flip chip die and each splitter die to the sacrificial carrier that includes test probe circuitry; testing the flip chip and splitter dies; replacing any faulty dies; overmolding the flip chip and splitter dies on the sacrificial carrier to form a panel of embedded dies; planarizing the panel of embedded dies to expose back surfaces of the embedded dies; forming a metallization layer across the back surface of the panel of embedded dies; and removing the sacrificial carrier to expose a front surface of the panel of embedded dies, wherein a contact surface of each solder bump of each flip chip die and splitter die is exposed in the front surface.

公开(公告)号：US12061228B2

公开(公告)日：2024-08-13

申请号：US17805555

申请日：2022-06-06

Applicant: NXP B.V.

Inventor： Michiel van Soestbergen ,  Amar Ashok Mavinkurve

IPC: G01R31/28

CPC classification number: G01R31/2889

Abstract: A device comprises a substrate and a stacked bond ball structure. The substrate comprises a bond pad, and the stacked bond ball structure comprises a first and a second bond ball. The first bond ball is in contact with the bond pad, and the second bond ball is positioned on the first bond ball. The stacked bond ball structure is configured to be coupled to a resistance-sensing circuit, such that a resistance of an interface between the first bond ball and the bond pad can be measured to determine an amount of degradation of the interface between the first bond ball and the bond pad. In some implementations, the device further comprises a controller configured to obtain a measured resistance of the interface from the resistance-sensing circuit and determine the amount of degradation of the interface based at least in part on the measured resistance.

公开(公告)号：US09461005B2

公开(公告)日：2016-10-04

申请号：US14620575

申请日：2015-02-12

Applicant: NXP B.V.

Inventor： Christian Weinschenk ,  Amar Ashok Mavinkurve

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/02 ,  H01L21/56

CPC classification number: H01L23/564 ,  H01L21/02282 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/4952 ,  H01L23/66 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An RF package including: an RF circuit; a non-gaseous dielectric material coupled to the RF circuit, and having a thickness based on a magnetic field in the RF circuit; and an encapsulant material coupled to cover the RF circuit and non-gaseous dielectric material on at least one side of the RF circuit. A package manufacturing method, including: identifying an RF circuit; dispensing a non-gaseous dielectric material upon the RF circuit, wherein at least a portion of the non-gaseous dielectric material has a thickness based on a magnetic field in the RF circuit; and covering the RF circuit and non-gaseous dielectric material with an encapsulant material on at least one side of the RF circuit.

Abstract translation: RF封装包括：RF电路; 耦合到所述RF电路的非气体介电材料，并且具有基于所述RF电路中的磁场的厚度; 以及密封剂材料，其耦合以在RF电路的至少一侧上覆盖RF电路和非气体介电材料。 一种封装制造方法，包括：识别RF电路; 在RF电路上分配非气态电介质材料，其中至少一部分非气体电介质材料具有基于RF电路中的磁场的厚度; 并且在RF电路的至少一侧上用密封剂材料覆盖RF电路和非气体介电材料。

公开(公告)号：US20240413192A1

公开(公告)日：2024-12-12

申请号：US18329847

申请日：2023-06-06

Applicant: NXP B.V.

Inventor： Paul Southworth ,  Michiel van Soestbergen ,  Amar Ashok Mavinkurve ,  Wen Yuan Chuang ,  Michael B. Vincent

IPC: H01L21/02

Abstract: A semiconductor device may include a semiconductor substrate and an isolation structure including a first dielectric layer formed over the semiconductor substrate, the first dielectric layer including one or more air gaps, and a first conductive structure formed on the dielectric layer, the conductive structure having a lower surface that faces the semiconductor substrate. Respective air gaps of the one or more air gaps of the first dielectric layer each may be disposed directly between corners of the lower surface of the conductive structure and the semiconductor substrate.

公开(公告)号：US20220263222A1

公开(公告)日：2022-08-18

申请号：US17649725

申请日：2022-02-02

Applicant: NXP B.V.

Inventor： Antonius Hendrikus Jozef Kamphuis ,  Jan Willem Bergman ,  Marcellinus Johannes Maria Geurts ,  Mustafa Acar ,  Paul Mattheijssen ,  Rajesh Mandamparambil ,  Andrei-Alexandru Damian ,  Amar Ashok Mavinkurve

IPC: H01Q1/22 ,  H01Q9/04 ,  H01L25/065 ,  H01L23/60 ,  H01L25/00

Abstract: A semiconductor device comprising a substrate, a first integrated circuit package mounted on the substrate, the first integrated circuit package comprising a first antenna sub-array having a uniform pitch, and a second integrated circuit package mounted on the substrate, the second integrated circuit package comprising a second antenna sub-array having a uniform pitch. The second integrated circuit package is mounted adjacent to the first integrated circuit package to form a multi-package module having an antenna array formed of the first antenna sub-array and the second antenna sub-array, wherein the antenna array has a uniform pitch. Also provided is a method of manufacturing a multi-package module and a method of providing package-to-package grounding.

公开(公告)号：US20230393192A1

公开(公告)日：2023-12-07

申请号：US17805555

申请日：2022-06-06

Applicant: NXP B.V.

Inventor： Michiel van Soestbergen ,  Amar Ashok Mavinkurve

IPC: G01R31/28

CPC classification number: G01R31/2889

Abstract: A device comprises a substrate and a stacked bond ball structure. The substrate comprises a bond pad, and the stacked bond ball structure comprises a first and a second bond ball. The first bond ball is in contact with the bond pad, and the second bond ball is positioned on the first bond ball. The stacked bond ball structure is configured to be coupled to a resistance-sensing circuit, such that a resistance of an interface between the first bond ball and the bond pad can be measured to determine an amount of degradation of the interface between the first bond ball and the bond pad. In some implementations, the device further comprises a controller configured to obtain a measured resistance of the interface from the resistance-sensing circuit and determine the amount of degradation of the interface based at least in part on the measured resistance.

公开(公告)号：US10593635B2

公开(公告)日：2020-03-17

申请号：US15937278

申请日：2018-03-27

Applicant: NXP B.V.

Inventor： Antonius Hendrikus Jozef Kamphuis ,  Paul Southworth ,  Keith Richard Sarault ,  Marcellinus Johannes Maria Geurts ,  Jeroen Johannes Maria Zaal ,  Johannes Henricus Johanna Janssen ,  Amar Ashok Mavinkurve

IPC: H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/427 ,  H01L23/538 ,  H01L23/00 ,  H01P5/16 ,  H01Q1/22 ,  H01Q21/00 ,  H01Q1/52 ,  H01L23/522

Abstract: Embodiments are provided for a multi-die packaged semiconductor device including: a panel of embedded dies including a plurality of radio frequency (RF) dies, wherein each RF die includes RF front-end circuitry, each RF die has an active side that includes a plurality of pads, each RF die has a back side exposed in a back side of the panel; a plurality of antenna connectors formed on a subset of the plurality of pads of each RF die; and an array of antennas formed over a front side of the panel and connected to the plurality of antenna connectors.

公开(公告)号：US12199333B2

公开(公告)日：2025-01-14

申请号：US17649725

申请日：2022-02-02

Applicant: NXP B.V.

Inventor： Antonius Hendrikus Jozef Kamphuis ,  Jan Willem Bergman ,  Marcellinus Johannes Maria Geurts ,  Mustafa Acar ,  Paul Mattheijssen ,  Rajesh Mandamparambil ,  Andrei-Alexandru Damian ,  Amar Ashok Mavinkurve

IPC: H01Q1/22 ,  H01L23/60 ,  H01L25/00 ,  H01L25/065 ,  H01Q9/04

Abstract: A semiconductor device comprising a substrate, a first integrated circuit package mounted on the substrate, the first integrated circuit package comprising a first antenna sub-array having a uniform pitch, and a second integrated circuit package mounted on the substrate, the second integrated circuit package comprising a second antenna sub-array having a uniform pitch. The second integrated circuit package is mounted adjacent to the first integrated circuit package to form a multi-package module having an antenna array formed of the first antenna sub-array and the second antenna sub-array, wherein the antenna array has a uniform pitch. Also provided is a method of manufacturing a multi-package module and a method of providing package-to-package grounding.

公开(公告)号：US20160240491A1

公开(公告)日：2016-08-18

申请号：US14620575

申请日：2015-02-12

Applicant: NXP B.V.

Inventor： Christian Weinschenk ,  Amar Ashok Mavinkurve

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/02 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L23/564 ,  H01L21/02282 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/4952 ,  H01L23/66 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An RF package including: an RF circuit; a non-gaseous dielectric material coupled to the RF circuit, and having a thickness based on a magnetic field in the RF circuit; and an encapsulant material coupled to cover the RF circuit and non-gaseous dielectric material on at least one side of the RF circuit. A package manufacturing method, including: identifying an RF circuit; dispensing a non-gaseous dielectric material upon the RF circuit, wherein at least a portion of the non-gaseous dielectric material has a thickness based on a magnetic field in the RF circuit; and covering the RF circuit and non-gaseous dielectric material with an encapsulant material on at least one side of the RF circuit.

Abstract translation: RF封装包括：RF电路; 耦合到所述RF电路的非气体介电材料，并且具有基于所述RF电路中的磁场的厚度; 以及密封剂材料，其耦合以在RF电路的至少一侧上覆盖RF电路和非气体介电材料。 一种封装制造方法，包括：识别RF电路; 在RF电路上分配非气态电介质材料，其中所述非气态电介质材料的至少一部分具有基于所述RF电路中的磁场的厚度; 并且在RF电路的至少一侧上用密封剂材料覆盖RF电路和非气体介电材料。