公开(公告)号：US10431575B2

公开(公告)日：2019-10-01

申请号：US15846425

申请日：2017-12-19

Applicant: NXP B.V.

Inventor： Antonius Hendrikus Jozef Kamphuis ,  Jeroen Johannes Maria Zaal ,  Johannes Henricus Johanna Janssen ,  Amar Ashok Mavinkurve

IPC: H01L25/00 ,  H01L21/66 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L23/00 ,  H01L23/538 ,  H01L25/18 ,  H04B1/40 ,  H01L23/367 ,  H01L23/427 ,  H04B1/04 ,  H04B1/16

Abstract: Embodiments are provided that include a method for fabricating a multi-die package including: placing a plurality of flip chip dies and splitter dies on the sacrificial carrier; performing solder reflow to join solder bumps of each flip chip die and each splitter die to the sacrificial carrier that includes test probe circuitry; testing the flip chip and splitter dies; replacing any faulty dies; overmolding the flip chip and splitter dies on the sacrificial carrier to form a panel of embedded dies; planarizing the panel of embedded dies to expose back surfaces of the embedded dies; forming a metallization layer across the back surface of the panel of embedded dies; and removing the sacrificial carrier to expose a front surface of the panel of embedded dies, wherein a contact surface of each solder bump of each flip chip die and splitter die is exposed in the front surface.

公开(公告)号：US10593635B2

公开(公告)日：2020-03-17

申请号：US15937278

申请日：2018-03-27

Applicant: NXP B.V.

Inventor： Antonius Hendrikus Jozef Kamphuis ,  Paul Southworth ,  Keith Richard Sarault ,  Marcellinus Johannes Maria Geurts ,  Jeroen Johannes Maria Zaal ,  Johannes Henricus Johanna Janssen ,  Amar Ashok Mavinkurve

IPC: H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/427 ,  H01L23/538 ,  H01L23/00 ,  H01P5/16 ,  H01Q1/22 ,  H01Q21/00 ,  H01Q1/52 ,  H01L23/522

Abstract: Embodiments are provided for a multi-die packaged semiconductor device including: a panel of embedded dies including a plurality of radio frequency (RF) dies, wherein each RF die includes RF front-end circuitry, each RF die has an active side that includes a plurality of pads, each RF die has a back side exposed in a back side of the panel; a plurality of antenna connectors formed on a subset of the plurality of pads of each RF die; and an array of antennas formed over a front side of the panel and connected to the plurality of antenna connectors.