公开(公告)号：US20180174774A1

公开(公告)日：2018-06-21

申请号：US15900145

申请日：2018-02-20

Applicant: OMRON Corporation

Inventor： Ichizo SAKAMOTO ,  Makito MORII ,  Kazushi MAETA ,  Yuki YAMAMOTO

IPC: H01H9/30 ,  C23C18/52 ,  C23C18/32 ,  H01H1/0237 ,  H01H1/42 ,  H01H11/04

CPC classification number: H01H9/30 ,  C23C18/1662 ,  C23C18/32 ,  C23C18/52 ,  C25D7/00 ,  C25D15/00 ,  H01H1/0237 ,  H01H1/04 ,  H01H1/42 ,  H01H11/04 ,  H01H11/048 ,  H01H2011/046 ,  H01H2011/047 ,  H01H2201/016 ,  H01H2203/014 ,  H01H2209/002 ,  H01R13/03

Abstract: A surface layer including a base material made of a conductor and dispersed particles dispersed in the base material is formed on a surface of a fixed contact, and the dispersed particles each include a base particle that is metal oxide and a coating layer formed on an outer surface of the base particle.