公开(公告)号：US20230368986A1

公开(公告)日：2023-11-16

申请号：US18029442

申请日：2021-09-17

申请人： Siemens Aktiengesellschaft

发明人： Frank Graskowski ,  Uwe Jahnke ,  Denis Donner ,  Thomas Brauner ,  Klaus Oberndörfer

IPC分类号： H01H1/02 ,  H01H1/025 ,  H01H1/04 ,  H01H11/04

CPC分类号： H01H1/0203 ,  H01H1/025 ,  H01H1/04 ,  H01H11/041

摘要： A contact for a vacuum interrupter of a low, medium or high-voltage switchgear includes a contact rod composed of a first electrically conductive material and extending along a longitudinal axis of the contact, and a contact piece composed of a second electrically conductive material and fastened to an end face of the contact rod. The contact rod and the contact piece are materially bonded to one another at a connecting face. At least one of the contact rod or the contact piece has a wall which delimits the connecting face, rises perpendicularly to the longitudinal axis and is disposed such that the contact piece and the contact rod are also force-lockingly connected to one another by a force acting transversely to the longitudinal axis between the contact piece and the contact rod. A production method for such a contact is also provided.

公开(公告)号：US20190199026A1

公开(公告)日：2019-06-27

申请号：US16313975

申请日：2017-06-30

申请人： Mukerrem Cakmak ,  Mark D. Soucek

发明人： Mukerrem Cakmak ,  Mark D. Soucek

IPC分类号： H01R13/03 ,  C08F2/06 ,  H01H1/04

CPC分类号： H01R13/03 ,  B32B15/00 ,  C08F2/06 ,  H01H1/04

摘要： An electrical contact includes: a first contact surface; a second contact surface; and a coating dispersed on at least one of the first or second contact surfaces, where the coating includes the cured product of a telechelic polypropylene glycol-polyethylene glycol multi-block polymer.

公开(公告)号：US20160172069A1

公开(公告)日：2016-06-16

申请号：US14897604

申请日：2014-05-29

申请人： KANZACC CO., LTD.

发明人： Yoshinori SUMIYA ,  Isao SEGAWA

IPC分类号： H01B1/02 ,  B32B15/01

CPC分类号： H01B1/02 ,  B32B15/018 ,  C22C5/06 ,  H01H1/023 ,  H01H1/04 ,  H01R13/03

摘要： A contact terminal structure includes: a first plating layer formed on a surface of a substrate; and a second plating layer formed on a surface of the first plating layer as an outermost layer, in which the first plating layer is composed of a silver-tin alloy, the second plating layer is silver plating or an alloy essentially consisting of silver, the first plating layer has a hardness greater than the second plating layer, and the first plating layer has a Vickers hardness of 250 to 400 and the second plating layer has a Vickers hardness of 80 to 200.

摘要翻译： 接触端子结构包括：形成在基板的表面上的第一镀层; 以及在所述第一镀层的表面上形成的第二镀层作为最外层，其中所述第一镀层由银 - 锡合金构成，所述第二镀层为银镀或基本上由银组成的合金， 第一镀层的硬度大于第二镀层，第一镀层的维氏硬度为250-400，第二镀层的维氏硬度为80-200。

公开(公告)号：US08420427B2

公开(公告)日：2013-04-16

申请号：US11492671

申请日：2006-07-25

申请人： Shawn Jay Cunningham ,  Dana Richard DeReus ,  Subham Sett ,  John Gilbert

发明人： Shawn Jay Cunningham ,  Dana Richard DeReus ,  Subham Sett ,  John Gilbert

IPC分类号： H01L21/00

CPC分类号： B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

摘要： Methods for Implementation of a Switching Function in a Microscale Device and for Fabrication of a Microscale Switch. According to one embodiment, a method is provided for implementing a switching function in a microscale device. The method can include providing a stationary electrode and a stationary contact formed on a substrate. Further, a movable microcomponent suspended above the substrate can be provided. A voltage can be applied between the between a movable electrode of the microcomponent and the stationary electrode to electrostatically couple the movable electrode with the stationary electrode, whereby the movable component is deflected toward the substrate and a movable contact moves into contact with the stationary contact to permit an electrical signal to pass through the movable and stationary contacts. A current can be applied through the first electrothermal component to produce heating for generating force for moving the microcomponent.

摘要翻译： 用于实现微尺度装置中的切换功能以及用于制造微型开关的方法。 根据一个实施例，提供了一种用于在微型设备中实现切换功能的方法。 该方法可以包括提供固定电极和形成在基板上的固定触点。 此外，可以提供悬浮在基板上方的可移动微型部件。 可以在微型组件的可动电极和固定电极之间施加电压，以使可动电极与固定电极静电耦合，由此可动部件朝向基板偏转，并且可动触点移动到与固定触点接触 允许电信号通过可移动和固定触点。 可以通过第一电热部件施加电流以产生用于产生用于移动微型部件的力的加热。

公开(公告)号：US20110227409A1

公开(公告)日：2011-09-22

申请号：US13048101

申请日：2011-03-15

申请人： Shigenori TAKAHASHI ,  Eiji Masuda

发明人： Shigenori TAKAHASHI ,  Eiji Masuda

IPC分类号： B60L1/00 ,  H01H47/22

CPC分类号： H01H9/42 ,  H01H1/04 ,  H01H1/06 ,  H01H50/546

摘要： A relay includes contacts, a driving coil, a moving part, and a resistor. The driving coil generates a magnetic force in accordance with a command signal. The moving part is configured to be driven by the magnetic force to open and close the contacts. The resistor has a predetermined electrical resistance. When the command signal is at a first level, the relay is set to a first on-state in which the contacts are closed through the resistor. When the command signal is at a second level higher than the first level, the relay is set to a second on-state in which the contacts are closed through the moving part without the resistor.

摘要翻译： 继电器包括触点，驱动线圈，移动部件和电阻器。 驱动线圈根据命令信号产生磁力。 移动部件构造成由磁力驱动以打开和关闭触点。 电阻器具有预定的电阻。 当指令信号处于第一电平时，继电器被设置为第一接通状态，其中触点通过电阻器闭合。 当指令信号处于高于第一电平的第二电平时，继电器被设置为第二导通状态，其中触点通过没有电阻器的移动部件闭合。

公开(公告)号：US20080250785A1

公开(公告)日：2008-10-16

申请号：US11785119

申请日：2007-04-16

申请人： Gregory A. Carlson ,  Patrick E. Feierabend ,  John S. Foster ,  Daryl W. Grummit ,  Alok Paranjpye ,  Paul J. Rubel ,  Jeffery F. Summers ,  Douglas L. Thompson

发明人： Gregory A. Carlson ,  Patrick E. Feierabend ,  John S. Foster ,  Daryl W. Grummit ,  Alok Paranjpye ,  Paul J. Rubel ,  Jeffery F. Summers ,  Douglas L. Thompson

IPC分类号： F01B29/10

CPC分类号： H01H1/0036 ,  H01H1/023 ,  H01H1/04 ,  H01H2001/0052 ,  H01H2001/0078 ,  H01H2061/006 ,  H01H2061/008

摘要： A MEMS switch device is made using a gold alloy as the switch contact material. The increased mechanical hardness of the alloy compared to the pure gold prevents the contacts of the switch from welding together. A scrubbing action which occurs when the switch closes may allow the contact surfaces to come to rest where their surfaces are complementary, thus resulting in higher contact area and low contact resistance, despite the higher sheet resistance of the gold alloy material relative to the pure gold material.

摘要翻译： 使用金合金作为开关触点材料制造MEMS开关装置。 与纯金相比，合金的增加的机械硬度防止开关的接触焊接在一起。 当开关闭合时发生的擦洗动作可允许接触表面在其表面互补的情况下停止，因此导致更高的接触面积和低的接触电阻，尽管金合金材料相对于纯金的较高的薄层电阻 材料。

公开(公告)号：US20080047816A1

公开(公告)日：2008-02-28

申请号：US11779367

申请日：2007-07-18

申请人： Takashi Kawakubo ,  Toshihiko Nagano ,  Michihiko Nishigaki

发明人： Takashi Kawakubo ,  Toshihiko Nagano ,  Michihiko Nishigaki

IPC分类号： H01H1/04 ,  B81B3/00

CPC分类号： H01H1/0036 ,  H01H1/023 ,  H01H1/04 ,  H01H2001/0052 ,  H01H2057/006

摘要： A Micro-Electro-Mechanical System (MEMS) switch includes: a substrate; a fixed electrode provided on the substrate; and a beam fixed to the substrate and including a movable electrode disposed to face the fixed electrode. The beam is capable of being bent and displaced in a direction of the substrate to allow the movable electrode to directly contact with the fixed electrode. At least one of the fixed electrode and the movable electrode contains Au, and the other contains at least one metal selected from a group consisting of Ir, Rh, Os, Ru, Re and Te as a main component.

摘要翻译： 微机电系统（MEMS）开关包括：基板; 设置在基板上的固定电极; 以及固定到所述基板并且包括设置成面对所述固定电极的可动电极的光束。 光束能够在基板的方向上弯曲和位移，以允许可动电极与固定电极直接接触。 固定电极和可动电极中的至少一个包含Au，另一方含有选自由Ir，Rh，Os，Ru，Re和Te组成的组中的至少一种金属作为主要成分。

公开(公告)号：US06934134B2

公开(公告)日：2005-08-23

申请号：US10378363

申请日：2003-03-03

申请人： Tetsuya Mori ,  Kenji Funaki ,  Yasusuke Takahashi ,  Kozo Maenishi

发明人： Tetsuya Mori ,  Kenji Funaki ,  Yasusuke Takahashi ,  Kozo Maenishi

IPC分类号： C22C32/00 ,  H01H1/0237 ,  H01H1/04 ,  H02H3/00

CPC分类号： C22C32/0021 ,  B22F2998/00 ,  H01H1/02372 ,  H01H1/02376 ,  H01H1/04 ,  B22F2207/20

摘要： The invention intends to provide a direct current load breaking contact point constitution that can make and break an electrical circuit under both direct current loads of direct current resistance load and direct current inductance load over a long period of time without causing problems such as {circle around (1)} the conduction defect due to the consumption of the contact point, {circle around (2)} the locking due to material transfer from one contact point to the other contact point, {circle around (3)} the welding between the contact points, and {circle around (4)} the abnormal arc continuation, and a direct current load breaking switching mechanism such as a relay, a switch and so on that has the contact point constitution. The direct current load breaking contact point constitution according to the invention comprises a movable contact point and a stationary contact point that face each other; wherein the movable contact point is made of AgSnO2In2O3 alloy that contains at least Ag, 8 to 15% by weight in total of metal oxides including SnO2 and In2O3, 6 to 10% by weight of SnO2 and 1 to 5% by weight of In2O3; the stationary contact point is made of AgZnO alloy that contains at least Ag and 7 to 11% by weight of ZnO; and polarity of a movable side is (+) and that of a stationary side is (−).

摘要翻译： 本发明旨在提供直流负载断开触点结构，其可以在直流电流负载和直流电感负载的两个直流负载下长时间地产生和断开电路，而不会引起诸如圆周的问题 （1）由于接触点的消耗引起的导电缺陷{圆周（2）由于从一个接触点到另一接触点的材料转移而导致的锁定，{圆周（3）接触点之间的焊接和{圆 围绕（4个异常电弧继续）以及具有接触点构成的诸如继电器，开关等的直流负载断路切换机构，根据本发明的直流负载断开触点构造包括可动触点 以及彼此面对的固定触点;其中所述可动触点由AgSnO 2 N 2 N 3 Al 3 y，其含有至少Ag，总共含有8〜15重量％的金属氧化物，包括SnO 2和N 2 O 3，6〜 10重量％的SnO 2 2和1至5重量％的In 2 N 3 O 3; 固定接触点由AgZnO合金制成，AgZnO合金至少含有Ag和7至11重量％的ZnO; 并且可动侧的极性为（+），而固定侧的极性为（ - ）。

公开(公告)号：US06917086B2

公开(公告)日：2005-07-12

申请号：US10817270

申请日：2004-04-02

申请人： Shawn Jay Cunningham ,  Svetlana Tatic-Lucic

发明人： Shawn Jay Cunningham ,  Svetlana Tatic-Lucic

IPC分类号： B81B3/00 ,  B81B7/00 ,  H01H1/04 ,  H01H1/50 ,  H01H59/00 ,  H01H61/04 ,  H01L21/302 ,  H01L23/373 ,  H01L23/522 ,  H01L27/12 ,  H01L29/86 ,  H02N1/00 ,  H02N10/00 ,  H01L29/82 ,  H01L21/00

CPC分类号： B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

摘要： Trilayered Beam MEMS Device and Related Methods. According to one embodiment, a method for fabricating a trilayered beam is provided. The method can include depositing a sacrificial layer on a substrate and depositing a first conductive layer on the sacrificial layer. The method can also include forming a first conductive microstructure by removing a portion of the first conductive layer. Furthermore, the method can include depositing a structural layer on the first conductive microstructure, the sacrificial layer, and the substrate and forming a via through the structural layer to the first conductive microstructure. Still furthermore, the method can include the following: depositing a second conductive layer on the structural layer and in the via; forming a second conductive microstructure by removing a portion of the second conductive layer, wherein the second conductive microstructure electrically communicates with the first conductive microstructure through the via; and removing a sufficient amount of the sacrificial layer so as to separate the first conductive microstructure from the substrate, wherein the structural layer is supported by the substrate at a first end and is freely suspended above the substrate at an opposing second end.

摘要翻译： 三层梁MEMS器件及相关方法。 根据一个实施例，提供一种制造三层梁的方法。 该方法可以包括在衬底上沉积牺牲层并在牺牲层上沉积第一导电层。 该方法还可以包括通过去除第一导电层的一部分来形成第一导电微结构。 此外，该方法可以包括在第一导电微结构，牺牲层和衬底上沉积结构层，并且通过结构层将通孔形成到第一导电微结构。 此外，该方法可以包括以下：在结构层和通孔中沉积第二导电层; 通过去除所述第二导电层的一部分来形成第二导电微结构，其中所述第二导电微结构通过所述通孔与所述第一导电微结构电连通; 以及去除足够量的牺牲层以便将第一导电微结构与衬底分开，其中结构层在第一端由衬底支撑并且在相对的第二端处自由地悬挂在衬底上方。

公开(公告)号：US06882264B2

公开(公告)日：2005-04-19

申请号：US10290807

申请日：2002-11-08

申请人： Shawn Jay Cunningham

发明人： Shawn Jay Cunningham

IPC分类号： B81B3/00 ,  B81B7/00 ,  H01H1/04 ,  H01H1/50 ,  H01H59/00 ,  H01H61/04 ,  H01L21/302 ,  H01L23/373 ,  H01L23/522 ,  H01L27/12 ,  H01L29/86 ,  H02N1/00 ,  H02N10/00 ,  H01H37/52 ,  H02N2/00

CPC分类号： B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

摘要： Electrothermal Self-Latching MEMS Switch and Method. According to one embodiment, a microscale switch having a movable microcomponent is provided and includes a substrate having a stationary contact. The switch can also include a structural layer having a movable contact positioned for contacting the stationary contact when the structural layer moves toward the substrate. An electrothermal latch attached to the structural layer and having electrical communication with the movable contact to provide current flow between the electrothermal latch and the stationary contact when the movable contact contacts the stationary contact for maintaining the movable contact in contact with the stationary contact.

摘要翻译： 电热自锁式MEMS开关及方法。 根据一个实施例，提供具有可移动微组件的微型开关，并且包括具有固定触点的基板。 该开关还可以包括具有可移动触点的结构层，该结构层定位成当结构层向衬底移动时与固定触点接触。 一个电热锁定件，其连接到结构层并且当可动触点接触固定触点以便使可动触点与固定触点接触时，与可动触头电连通以提供电热闩和固定触点之间的电流。