公开(公告)号：US20220416133A1

公开(公告)日：2022-12-29

申请号：US17757579

申请日：2020-12-10

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Christian Betthausen ,  Olivier Leray ,  Muyuan Li ,  Benjamin Gruber ,  Michael Steyer ,  Alexander Linkov ,  Stefan Handl

IPC: H01L33/58 ,  H01L33/48

Abstract: In an embodiment a method for operating an optoelectronic semiconductor component includes providing the optoelectronic semiconductor component having an optoelectronic semiconductor chip and a casing comprising a matrix material, wherein the semiconductor chip is embedded into the casing, and wherein optically inactive particles have been introduced as crack nuclei into the matrix material of the casing, and operating the optoelectronic semiconductor component such that cavities form entirely within the casing for at least some of the crack nuclei.