公开(公告)号：US20180026421A1

公开(公告)日：2018-01-25

申请号：US15654136

申请日：2017-07-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jan Seidenfaden ,  Jan Marfeld ,  Hubert Schmid ,  Soenke Tautz ,  Roland Enzmann

IPC: H01S5/022 ,  H01S5/024 ,  H01S5/00

Abstract: A laser component includes a housing, a laser chip arranged in the housing, and a conversion element for radiation conversion arranged in the housing wherein the conversion element is irradiatable with laser radiation of the laser chip. A method of producing such a laser component includes providing component parts of the laser component including a laser chip, a conversion element for radiation conversion and housing parts, and assembling the component parts of the laser component such that a housing is provided within which the laser chip and the conversion element are arranged, wherein the conversion element is irradiatable with laser radiation of the laser chip.

公开(公告)号：US10431954B2

公开(公告)日：2019-10-01

申请号：US15654136

申请日：2017-07-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jan Seidenfaden ,  Jan Marfeld ,  Hubert Schmid ,  Soenke Tautz ,  Roland Enzmann

IPC: H01S5/00 ,  H01S5/022 ,  H01S5/024 ,  H01S5/40

Abstract: A laser component includes a housing, a laser chip arranged in the housing, and a conversion element for radiation conversion arranged in the housing wherein the conversion element is irradiatable with laser radiation of the laser chip. A method of producing such a laser component includes providing component parts of the laser component including a laser chip, a conversion element for radiation conversion and housing parts, and assembling the component parts of the laser component such that a housing is provided within which the laser chip and the conversion element are arranged, wherein the conversion element is irradiatable with laser radiation of the laser chip.