公开(公告)号：US20220411261A1

公开(公告)日：2022-12-29

申请号：US17801230

申请日：2021-02-19

Applicant: Obsidian Sensors, Inc.

Inventor： John HONG ,  Tallis CHANG ,  Sean ANDREWS ,  Jan BOS ,  Jia-Wei MA

IPC: B81C1/00 ,  B81B7/00

Abstract: In some embodiments, electromechanical systems including a semiconductor layer that has a planar surface and includes conductive and adjacent non-conductive regions and a hermetic seal applied above the planar surface and methods of manufacturing the systems are disclosed. In some embodiments, electromechanical devices that include first and second planar semiconductor layers are disclosed. Each of the semiconductor layers includes conductive regions, and at least one conductive region from each of the layers is electrically coupled to each other. Methods of manufacturing the electromechanical devices are also disclosed.