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公开(公告)号：US11624657B2
公开(公告)日：2023-04-11
申请号：US17267789
申请日：2019-08-09
发明人： John Hong , Bing Wen , Edward Chan , Tallis Chang , Sean Andrews
摘要： Disclosed herein are MEMS devices and systems and methods of manufacturing or operating the MEMS devices and systems for transmitting and detecting radiation. The devices and methods described herein are applicable to terahertz radiation. In some embodiments, the MEMS devices and systems are used in imaging applications. In some embodiments, a microelectromechanical system comprises a glass substrate configured to pass radiation from a first surface of the glass substrate through a second surface of the glass substrate, the glass substrate comprising TFT circuitry; a lid comprising a surface; spacers separating the lid and glass substrate; a cavity defined by the spacers, surface of the lid, and second surface of the glass substrate; a pixel in the cavity, positioned on the second surface of the glass substrate, electrically coupled to the TFT circuitry, and comprising an absorber to detect the radiation; and a reflector to direct the radiation to the absorbers and positioned on the lid.
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公开(公告)号：US20230036855A1
公开(公告)日：2023-02-02
申请号：US17815895
申请日：2022-07-28
发明人： Heesun SHIN , John HONG , Tallis CHANG , Bing WEN
摘要： Circuitries for controlling a power consuming device are disclosed. Methods for operating the circuitries and manufacturing the circuitries are also disclosed. In some embodiments, the circuit comprises a first thin-film transistor (TFT), a second TFT, and a storage capacitor. The first TFT is configured to output a current to a power consuming device. The second TFT is configured to provide a control voltage to the first TFT for controlling an amount of the current. The storage capacitor is configured to store the control voltage.
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公开(公告)号：US11555744B2
公开(公告)日：2023-01-17
申请号：US17048046
申请日：2019-04-17
发明人： Edward Chan , Bing Wen , John Hong , Tallis Chang , Seung-Tak Ryu
摘要： Methods of sensor readout and calibration and circuits for performing the methods are disclosed. In some embodiments, the methods include driving an active sensor at a voltage. In some embodiments, the methods include use of a calibration sensor, and the circuits include the calibration sensor. In some embodiments, the methods include use of a calibration current source and circuits include the calibration current source. In some embodiments, a sensor circuit includes a Sigma-Delta ADC. In some embodiments, a column of sensors is readout using first and second readout circuits during a same row time.
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公开(公告)号：US20200294878A1
公开(公告)日：2020-09-17
申请号：US16660664
申请日：2019-10-22
IPC分类号： H01L23/31 , B81C1/00 , B81B7/00 , H01L21/56 , H01L21/683 , H01L21/768 , H01L23/522 , H01L23/528 , H01L27/12 , H01L33/52 , H01L33/62 , H01L51/00 , H01L51/52 , H01L51/56
摘要： This disclosure provides devices and methods for 3-D device packaging with backside interconnections. One or more device elements can be hermetically sealed from an ambient environment, such as by vacuum lamination and bonding. One or more via connections provide electrical interconnection from a device element to a back side of a device substrate, and provide electrical interconnection from the device substrate to external circuitry on the back side of the device. The external circuitry can include a printed circuit board or flex circuit. In some implementations, an electrically conductive pad is provided on the back side, which is electrically connected to at least one of the via connections. In some implementations, the one or more via connections are electrically connected to one or more electrical components or interconnections, such as a TFT or a routing line.
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公开(公告)号：US20180364439A1
公开(公告)日：2018-12-20
申请号：US15625089
申请日：2017-06-16
发明人： Yaoling PAN , Jian MA , John HONG , Tallis CHANG
摘要： Conventional optical lens assembly typically require a capping window, which is expensive, to protect the optical sensor. Also, each conventional optical lens assembly is discretely assembled, and thus incurs additional costs. To address these and other disadvantages, it is proposed to assemble a plurality of imaging sensors, a plurality of spacers, and a plurality of lenses at a panel. The resulting lens assembly array can be individualized into separate lens assemblies.
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公开(公告)号：US09936129B2
公开(公告)日：2018-04-03
申请号：US15183528
申请日：2016-06-15
发明人： Bing Wen , Edward Chan , Shen-Ge Wang , Jian Ma , John Hong
CPC分类号： H04N5/23232 , G06T3/4053 , H04N5/2258 , H04N5/2621
摘要： Techniques are disclosed for generating a high resolution image from a plurality of images captured from a plurality of sensors. The pixels in one sensor have at least one of different size, shape, or orientation than pixels in another sensor. The difference in size, shape, or orientation of the pixels and the interconnection of pixels on respective sensors provides a high level of certainty that there will be sufficient difference in the captured images, with limited loss in image content, to generate a relatively high resolution image from the images captured by the respective sensors.
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公开(公告)号：US20220411261A1
公开(公告)日：2022-12-29
申请号：US17801230
申请日：2021-02-19
发明人： John HONG , Tallis CHANG , Sean ANDREWS , Jan BOS , Jia-Wei MA
摘要： In some embodiments, electromechanical systems including a semiconductor layer that has a planar surface and includes conductive and adjacent non-conductive regions and a hermetic seal applied above the planar surface and methods of manufacturing the systems are disclosed. In some embodiments, electromechanical devices that include first and second planar semiconductor layers are disclosed. Each of the semiconductor layers includes conductive regions, and at least one conductive region from each of the layers is electrically coupled to each other. Methods of manufacturing the electromechanical devices are also disclosed.
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公开(公告)号：US20210306535A1
公开(公告)日：2021-09-30
申请号：US17214635
申请日：2021-03-26
发明人： John HONG , Bing WEN , Tallis CHANG
IPC分类号： H04N5/225
摘要： An imaging device comprising two camera apertures and a method of capturing two fields of view using two camera apertures are disclosed.
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公开(公告)号：US20210164839A1
公开(公告)日：2021-06-03
申请号：US17267789
申请日：2019-08-09
发明人： John HONG , Bing WEN , Edward CHAN , Tallis CHANG , Sean ANDREWS
摘要： Disclosed herein are MEMS devices and systems and methods of manufacturing or operating the MEMS devices and systems for transmitting and detecting radiation. The devices and methods described herein are applicable to terahertz radiation. In some embodiments, the MEMS devices and systems are used in imaging applications. In some embodiments, a microelectromechanical system comprises a glass substrate configured to pass radiation from a first surface of the glass substrate through a second surface of the glass substrate, the glass substrate comprising TFT circuitry; a lid comprising a surface; spacers separating the lid and glass substrate; a cavity defined by the spacers, surface of the lid, and second surface of the glass substrate; a pixel in the cavity, positioned on the second surface of the glass substrate, electrically coupled to the TFT circuitry, and comprising an absorber to detect the radiation; and a reflector to direct the radiation to the absorbers and positioned on the lid.
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公开(公告)号：US20210102844A1
公开(公告)日：2021-04-08
申请号：US17048046
申请日：2019-04-17
发明人： Edward CHAN , Bing WEN , John HONG , Tallis CHANG , Seung-Tak RYU
摘要： Methods of sensor readout and calibration and circuits for performing the methods are disclosed. In some embodiments, the methods include driving an active sensor at a voltage. In some embodiments, the methods include use of a calibration sensor, and the circuits include the calibration sensor. In some embodiments, the methods include use of a calibration current source and circuits include the calibration current source. In some embodiments, a sensor circuit includes a Sigma-Delta ADC. In some embodiments, a column of sensors is readout using first and second readout circuits during a same row time.
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