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    SENSOR DESIGN
    2.
    发明申请
    SENSOR DESIGN 有权

    公开(公告)号：US20240379694A1

    公开(公告)日：2024-11-14

    申请号：US18689802

    申请日：2022-09-07

    Applicant: OBSIDIAN SENSORS, INC.

    Inventor： Heesun SHIN ,  Bing WEN ,  Edward CHAN ,  Sean ANDREWS ,  Tallis CHANG ,  John HONG

    IPC: H01L27/146

    Abstract: Electronic devices comprising pixels for sensing, methods for operating the electronic devices, and methods for manufacturing the electronic devices are disclosed. In some embodiments, the electronic devices comprise hinges for supporting the pixels. In some embodiments, the electronic devices are configured to provide a bias voltage to the pixels.

    CHARGE TRANSFER CIRCUITRY FOR MEMS DEVICES
    3.
    发明申请
    CHARGE TRANSFER CIRCUITRY FOR MEMS DEVICES 有权

    公开(公告)号：US20230061174A1

    公开(公告)日：2023-03-02

    申请号：US17896978

    申请日：2022-08-26

    Applicant: Obsidian Sensors, Inc.

    Inventor： John HONG ,  Tallis CHANG ,  Bing WEN ,  Edward CHAN ,  Sean ANDREWS ,  Heesun SHIN

    IPC: B81B7/02 ,  B81C1/00

    Abstract: Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge. In some embodiments, the MEMS devices comprise a charge transfer circuit for providing the amount of charge.

    ACTIVE MATRIX PROGRAMMABLE MIRROR
    4.
    发明申请
    ACTIVE MATRIX PROGRAMMABLE MIRROR 有权

    公开(公告)号：US20210294093A1

    公开(公告)日：2021-09-23

    申请号：US17207433

    申请日：2021-03-19

    Applicant: Obsidian Sensors, Inc.

    Inventor： John HONG ,  Tallis CHANG ,  Bing WEN ,  Edward CHAN ,  Sean ANDREWS ,  Heesun SHIN

    IPC: G02B26/08 ,  B81B7/02 ,  B81C1/00

    Abstract: Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge.

    DISPERSION ENGINEERED EVANESCENT MEMS OPTICAL MODULATORS
    5.
    发明申请
    DISPERSION ENGINEERED EVANESCENT MEMS OPTICAL MODULATORS 有权

    公开(公告)号：US20250123444A1

    公开(公告)日：2025-04-17

    申请号：US18915202

    申请日：2024-10-14

    Applicant: Obsidian Sensors, Inc.

    Inventor： Karl JOHNSON ,  John HONG ,  Bing WEN ,  Sean ANDREWS ,  Heesun SHIN ,  Edward CHAN ,  Tallis CHANG

    IPC: G02B6/35

    Abstract: An integrated MEMS waveguide modulator, including: a static, non-suspended waveguide to guide light traveling through the waveguide; and a dielectric slab movable into and out of an evanescent field surrounding the waveguide using an actuation mechanism, wherein the dielectric slab is movable between a first position that is farthest away possible for the slab from the waveguide and a second position that is closest possible for the slab from the waveguide, wherein dispersion characteristic of the light is controlled by moving the dielectric slab from an unactuated mode that is at the first position to an actuated mode that is at the second position, and wherein the dielectric slab is layered to include non-uniform refractive index profile.

    MEMS AND NEMS STRUCTURES
    6.
    发明申请
    MEMS AND NEMS STRUCTURES 有权

    公开(公告)号：US20250042727A1

    公开(公告)日：2025-02-06

    申请号：US18737611

    申请日：2024-06-07

    Applicant: OBSIDIAN SENSORS, INC.

    Inventor： John HONG ,  Tallis CHANG ,  Edward CHAN ,  Bing WEN ,  Yaoling PAN ,  Sean ANDREWS

    IPC: B81C1/00 ,  B81B3/00 ,  G01J5/20

    Abstract: An electromechanical systems structure including: providing a stack, including a structural layer extending in a plane, a sidewall layer including a first portion lying in a plane parallel to the structural layer plane and a second portion lying in a plane transverse to the structural layer plane, an etch-stop layer, positioned between the sidewall layer and the structural layer, including an etch-selectivity different from an etch-selectivity of the structural layer and an etch-selectivity of the sidewall layer, and a mold comprising a wall parallel to the sidewall layer's second portion; etching the sidewall layer's first portion to expose the etch-stop layer; removing the mold; etching the etch-stop layer such that the sidewall layer's second portion masks a portion of the etch-stop layer; removing the sidewall layer's second portion; and etching the structural layer such that the portion of the etch-stop layer masks a portion of the structural layer.

    MEMS DEVICE MANUFACTURING
    8.
    发明公开
    MEMS DEVICE MANUFACTURING 审中-公开

    公开(公告)号：US20240043264A1

    公开(公告)日：2024-02-08

    申请号：US18266514

    申请日：2021-12-09

    Applicant: Obsidian Sensors, Inc.

    Inventor： Tallis CHANG ,  Sean ANDREWS

    IPC: B81B7/00 ,  B81C3/00

    CPC classification number: B81B7/0006 ,  B81C3/001 ,  B81B2201/0207 ,  B81B2207/07 ,  B81C2203/035

    Abstract: Some embodiments include methods of manufacturing a plurality of MEMS devices, each device including a first material and a second material with different CTE. The method includes providing a carrier with substantially equal CTE as the first material, the carrier comprising a plurality of cavities. The method also includes positioning a plurality of components in respective cavities of the carrier, the components comprising the second material. In some embodiments, the method includes positioning a layer of the first material on the second material components. In some embodiments, the method includes bonding the first material layer and the second material components. The method also includes removing the carrier and singulating the first material layer to produce the plurality of MEMS devices.

    CROSSOVERS FOR VACUUM PACKAGING
    10.
    发明申请
    CROSSOVERS FOR VACUUM PACKAGING 有权

    公开(公告)号：US20220411261A1

    公开(公告)日：2022-12-29

    申请号：US17801230

    申请日：2021-02-19

    Applicant: Obsidian Sensors, Inc.

    Inventor： John HONG ,  Tallis CHANG ,  Sean ANDREWS ,  Jan BOS ,  Jia-Wei MA

    IPC: B81C1/00 ,  B81B7/00

    Abstract: In some embodiments, electromechanical systems including a semiconductor layer that has a planar surface and includes conductive and adjacent non-conductive regions and a hermetic seal applied above the planar surface and methods of manufacturing the systems are disclosed. In some embodiments, electromechanical devices that include first and second planar semiconductor layers are disclosed. Each of the semiconductor layers includes conductive regions, and at least one conductive region from each of the layers is electrically coupled to each other. Methods of manufacturing the electromechanical devices are also disclosed.

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