公开(公告)号：US10449750B2

公开(公告)日：2019-10-22

申请号：US14591483

申请日：2015-01-07

Applicant: Orthobond Corporation

Inventor： Carlos Caicedo-Carvajal ,  Randy Clevenger ,  Sam Hong ,  Jordan Katz ,  Cheoljin Kim

IPC: B32B7/12 ,  C09J175/14 ,  B32B7/10 ,  B32B27/06 ,  B32B27/08 ,  B32B27/16 ,  B32B27/28 ,  B32B27/36 ,  B32B5/06 ,  B32B27/30 ,  B32B27/34 ,  B32B27/38 ,  B32B27/40

Abstract: Disclosed in certain embodiments is a composition comprising a first material; an adhesive material attached to the first material; a plurality of linker molecules bonded to the adhesive material; and a second material bonded to the linker molecules.