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公开(公告)号:US20150325922A1
公开(公告)日:2015-11-12
申请号:US14702040
申请日:2015-05-01
Inventor: SUGURU FUJITA , YUICHI KASHINO , MAKI NAKAMURA , KENTARO WATANABE
CPC classification number: H01Q19/06 , H01L2223/6677 , H01L2224/16227 , H01L2924/15321 , H01Q1/38 , H01Q3/16 , H01Q19/104 , H01Q19/106 , H01Q21/065
Abstract: An antenna device includes a wireless module, a module substrate, and a metal plate. The wireless module includes an antenna element that operates in a millimeter wave band. The module substrate is a multi-layer wiring module substrate on which the wireless module is mounted. The metal plate has a length of 1/10 or more of an operation wavelength and is positioned in a vertical direction relative to a plane surface of the antenna element and in a predetermined distance from the antenna element.
Abstract translation: 天线装置包括无线模块,模块基板和金属板。 无线模块包括在毫米波段中操作的天线元件。 模块基板是安装无线模块的多层布线模块基板。 金属板的长度为工作波长的1/10以上,并相对于天线元件的平面而位于与天线元件规定距离的垂直方向上。