公开(公告)号：US20170336436A1

公开(公告)日：2017-11-23

申请号：US15526333

申请日：2016-01-08

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： YUKI MAEGAWA ,  HIDEKI UEDA ,  HIDEAKI FUJIURA ,  TAKESHI UEMURA ,  HIROSHI NAKATSUKA ,  TSUYOSHI SAKAUE ,  RIE OKAMOTO ,  SHOYA KIDA

IPC: G01P15/125 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

Abstract: A sensor includes a sensor element, a package accommodating the sensor element in an inside of the package, a grounding electrode disposed in the package, a lid covering an opening of the package, and a lead extending from the package. The lead includes first and second portions. The first portion of the lead is electrically connected to the grounding electrode and extends along a side surface of the package with a gap provided between the first portion and the side surface. The second portion of the lead is disposed between the lid and the package and extends toward the inside of the package. In this sensor, the opening can be sealed without soldering and reliably connect the lid to the grounding electrode.