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公开(公告)号：US20220342161A1
公开(公告)日：2022-10-27
申请号：US17719447
申请日：2022-04-13
Inventor： TATSURO SHIRAISHI , TOMOTAKA FURUTA , JUNICHI KAMATANI
Abstract: An optical measuring device includes: a laser light source that emits first light having a first wavelength; an image capturing unit that emits second light having a second wavelength different from the first wavelength; a separating unit that receives the first light and the second light to direct the first light and the second light toward an object to be measured, and receives reflected light from the object to be measured to separate the reflected light into first reflected light based on the first light and second reflected light based on the second light; a light receiving element that receives the first reflected light separated by the separating unit; and a calculating unit that calculates a yawing angle and a pitching angle of the object to be measured based on a light receiving result of the light receiving element, in which the image capturing unit captures an image of the object to be measured by receiving the second reflected light separated by the separating unit, and the calculating unit calculates a rolling angle of the object to be measured based on an image capturing result acquired by the image capturing unit.
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公开(公告)号：US20250083251A1
公开(公告)日：2025-03-13
申请号：US18961344
申请日：2024-11-26
Inventor： KOJI FUNAMI , KAZUKI FUJIWARA , IZURU NAKAI , TATSURO SHIRAISHI
IPC: B23K26/064 , B23K26/36
Abstract: A laser machining device according to one aspect of the present disclosure includes: a welding device that irradiates a workpiece with laser irradiation light to perform welding; and a welding light measurement device including an imaging optical system, a first photodetector, and a second photodetector, the welding light measurement device receiving and measuring welding light emitted from the workpiece during laser welding. The welding light includes first light in a first wavelength region and second light in a second wavelength region, and the imaging optical system includes a wavelength selection mask, and forms an image of a light beam of the first light transmitted through the wavelength selection mask on the first photodetector and forms an image of a light beam of the second light transmitted through the wavelength selection mask on the second photodetector. The wavelength selection mask includes a first region and a second region that receive the welding light, the first region reflects the second light and transmits the first light, the second region transmits the first light and the second light, and the second region has a smaller light receiving area than the first region. The first photodetector and the second photodetector are disposed on an optical axis of the welding light incident on the wavelength selection mask.
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Patent Agency Ranking
公开(公告)号：US20240302610A1
公开(公告)日：2024-09-12
申请号：US18665619
申请日：2024-05-16
Inventor： JUNICHI KAMATANI , TATSURO SHIRAISHI
IPC: G02B6/42
CPC classification number: G02B6/4239
Abstract: A method for connecting an optical waveguide includes: adjusting an inclination of an optical fiber block with respect to substrate (10), the optical fiber block including through-passage (34), and the substrate including spacer (60) surrounding light input part (12), by holding and bringing optical fiber block (20) into contact with the spacer, and then releasing the optical fiber block; supplying adhesive (70) to outside of the spacer on the substrate; aligning the optical fiber block holding an optical fiber, with respect to the light input part, to maximize intensity of light output from the substrate; compressing the spacer by pushing the optical fiber block including the through-passage toward the substrate; and curing the adhesive, with the spacer compressed.
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公开(公告)号：US20250093586A1
公开(公告)日：2025-03-20
申请号：US18964616
申请日：2024-12-01
Inventor： JUNICHI KAMATANI , TATSURO SHIRAISHI
IPC: G02B6/36
Abstract: A method for connecting an optical waveguide includes supplying adhesive (3) to near a light input unit on an optical circuit board, aligning optical fiber block (2) holding optical fiber (2a) with respect to the optical circuit board to maximize intensity of light emitted from the optical circuit board, starting curing of the adhesive, measuring a curing degree of the adhesive and an adhesive curing time during the curing of the adhesive, and repeating the alignment of the optical fiber block holding the optical fiber with respect to the optical circuit board to maximize the intensity of the light emitted from the optical circuit board in a state where the degree of curing is less than or equal to a certain threshold value.
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公开(公告)号：US20220365287A1
公开(公告)日：2022-11-17
申请号：US17723529
申请日：2022-04-19
Inventor： TOMOTAKA FURUTA , JUNICHI KAMATANI , TATSURO SHIRAISHI
Abstract: An optical adjustment apparatus includes a measurement-light irradiation part that has a plurality of second optical fibers and emits, with timings different from each other, a plurality of lights having a single wavelength via the second optical fibers, an optical fiber block that holds exit-side end portions of the first and second optical fibers, a light detection part that receives and detects a plurality of reflected lights via the second optical fibers, a tilt calculation part that compares, with each other, variations with time of intensities of the respective reflected lights and calculates a tilt of the optical fiber block relative to the optical substrate, and a distance calculation part that calculates an inter-end surface distance between the optical substrate and the optical fiber block, based on a variation with time of an intensity of at least one reflected light.
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公开(公告)号：US20250153271A1
公开(公告)日：2025-05-15
申请号：US19021458
申请日：2025-01-15
Inventor： IZURU NAKAI , KAZUKI FUJIWARA , KOJI FUNAMI , TATSURO SHIRAISHI
IPC: B23K26/03 , B23K26/082
Abstract: A laser welding monitoring apparatus includes an acquisition interface that acquires a signal corresponding to measurement light measured by irradiating a workpiece with laser light, an arithmetic circuit that determines the state of processing based on the acquired signal, and a storage device that stores in advance variation tendency information corresponding to a tendency of intensity of the measurement light to vary depending on a position of a processing point in a region scannable with the laser light by using an optical system including a galvanometer mirror and a scan lens on the workpiece. When scanning is performed with the laser light by the optical system in a predetermined welding pattern, and the acquisition interface acquires an intensity signal indicating intensity of the measurement light that has been received, the arithmetic circuit corrects the intensity signal and suppresses a variation in intensity depending on a position of the processing point based on the variation tendency information for each light and determines the state of processing based on the intensity signal that has been corrected.
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公开(公告)号：US20250058408A1
公开(公告)日：2025-02-20
申请号：US18935667
申请日：2024-11-04
Inventor： KAZUKI FUJIWARA , KOJI FUNAMI , IZURU NAKAI , TATSURO SHIRAISHI
Abstract: A determination method of a machining condition includes detecting, by using an optical sensor, at least one component of heat radiation, visible light, and reflected light generated at a welded portion provided on a surface of a workpiece by emission of a laser beam on the workpiece, acquiring a signal indicating a change in the at least one component in a time section from a start of welding to an end of welding of the workpiece, calculating a feature quantity based on a signal intensity of the signal in a predetermined section in the time section, determining, as the machining condition, presence or absence of a gap generated between superposed surfaces of the workpiece in an irradiation direction of the laser beam by inputting the calculated feature quantity to a determination model for determining the machining condition, and outputting the determined presence or absence of the gap as a determination result. The determination model is constructed based on training data including the feature quantity calculated under a plurality of conditions in which the machining condition changes and observed presence or absence of the gap in association with each other.
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