公开(公告)号：US20170220445A1

公开(公告)日：2017-08-03

申请号：US15155113

申请日：2016-05-16

Applicant: QUALCOMM INCORPORATED

Inventor： Adam CUNNINGHAM ,  Kwangyoon LEE ,  Melanie OCLIMA

IPC: G06F11/34 ,  G06F11/30

CPC classification number: G06F11/3409 ,  G06F1/203 ,  G06F1/206 ,  G06F11/3024 ,  G06F11/3089

Abstract: Various embodiments of methods and systems for intelligent thermal power management implemented in a portable computing device (“PCD”) are disclosed. To mitigate or alleviate hysteresis associated with drastic changes in processing speeds for thermally aggressive processing components, embodiments of the solution dynamically adjust performance level floors in view of a temperature reading. Advantageously, embodiments work to manage thermal energy generation based on temperature sensor feedback that is relatively slow to detect temperature changes.