公开(公告)号：US20210249359A1

公开(公告)日：2021-08-12

申请号：US16783768

申请日：2020-02-06

Applicant: QUALCOMM Incorporated

Inventor： Aniket PATIL ,  Bohan YAN ,  Hong Bok WE

IPC: H01L23/552 ,  H01L23/367 ,  H01L23/31 ,  H01L23/498 ,  H01L23/532 ,  H01L23/538 ,  H01L21/50

Abstract: Examples herein include better heat transfer from application processor(s) and power management system without affecting the EMI performance. In one example, a thermal solution structure improves thermal performance of a modular system with better EMI shielding with the addition of heat conduction pillars from the substrate metal layer to TIM material, which thereafter connects to a heat pipe. The pillar transfers heat from substrate to heat pipe and connects physically to a global ground reference net of the IC package and eventually to a system motherboard while the pillar shields components inside the array/ring. This gives both a thermal and EMI shield solution in a single structure.

公开(公告)号：US20190393120A1

公开(公告)日：2019-12-26

申请号：US16016888

申请日：2018-06-25

Applicant: QUALCOMM Incorporated

Inventor： Kuiwon KANG ,  Zhijie WANG ,  Bohan YAN

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00

Abstract: An integrated circuit package having an interposer with increased thermal conductivity and techniques for fabricating such an integrated circuit package are provided. One example integrated circuit package generally includes a package substrate, at least one semiconductor die disposed above the package substrate, and an interposer disposed above the at least one semiconductor die. The interposer includes a dielectric layer, and a metallic plate disposed adjacent to a first portion of the dielectric layer. The height of the metallic plate is greater than a height of the dielectric layer.