Abstract:
A method and apparatus for testing electronic devices installed in a portable device. The apparatus incorporates a socket with receptacles for alignment pins, and an alignment plate with openings for the alignment pins. The holes for the alignment pins are matched to the socket receptacles, providing secure alignment. The spring loaded socket pin mates with at least one solder ball. The apparatus also includes a circuit card, which may be a modem test platform circuit card that has contacts that mate with the at least one solder ball. Other functions may be tested using other circuit card assemblies. A method of testing includes: installing the electronic device to be tested into a socket assembly, aligning the electronic device to be tested into the socket assembly; installing the socket assembly into a test apparatus, and testing the device.