公开(公告)号：US11245175B2

公开(公告)日：2022-02-08

申请号：US16145100

申请日：2018-09-27

Applicant: QUALCOMM Incorporated

Inventor： Seong Heon Jeong ,  Rajneesh Kumar ,  Mohammad Ali Tassoudji ,  Darryl Jessie ,  Gurkanwal Sahota ,  Kevin Hsi Huai Wang ,  Jeong Il Kim ,  Taesik Yang ,  Thomas Myers ,  Neil Burns ,  Julio Zegarra ,  Clinton James Wilber ,  Jordan Szabo

IPC: H01Q1/24 ,  H01Q1/22 ,  H01L25/065 ,  H01L23/28 ,  H01L23/552 ,  H01L23/64 ,  H01L23/66 ,  H01Q1/52 ,  H01Q9/06 ,  H01Q9/26 ,  H01Q21/28 ,  H01L23/31 ,  H01Q9/04

Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.