ROTATABLE BRACKET MODULE
    1.
    发明公开

    公开(公告)号:US20240172374A1

    公开(公告)日:2024-05-23

    申请号:US18057624

    申请日:2022-11-21

    CPC classification number: H05K5/0069 H05K5/0226

    Abstract: A bracket module and a computing device including the bracket module are disclosed. The bracket module includes a housing structure. The housing structure includes a plurality of slots. Each slot is configured to accept a device inserted therein. The housing structure is configured for attachment in a chassis of the computing device. The bracket module further includes a tray structure. The tray structure includes a fixed end connected to the housing structure and a free end opposite from the fixed end. The tray structure is configured to rotate relative to the housing structure about the fixed end. The bracket module further includes at least one fastener configured to engage the tray structure with the housing structure in an open position.

    CARRIER DEVICE FOR VARIABLE THICKNESS E1.S STORAGE DEVICES

    公开(公告)号:US20240155798A1

    公开(公告)日:2024-05-09

    申请号:US18066057

    申请日:2022-12-14

    CPC classification number: H05K7/1489

    Abstract: A carrier for different form factors for insertion in a slot of a computing device is disclosed. The different form factors have different thicknesses defined by the E1.S specification. The carrier includes a base holding a first type of form factor. A bezel is configurable for insertion in a slot for a device of the first type of form factor. The bezel has an attachment surface. The base is attachable to the attachment surface of the bezel. A second type of form factor is also attachable to the attachment surface of the bezel. A cover encloses the first type of form factor when joined to the base. The base and cover are discarded when the second type of form factor is attached to the bezel. The attached bezel and second type of form factor may also be inserted in the slot.

    DUST-PROOF MECHANISM FOR MEMORY MODULE
    3.
    发明公开

    公开(公告)号:US20240015912A1

    公开(公告)日:2024-01-11

    申请号:US17860529

    申请日:2022-07-08

    Abstract: A dust-proof telecommunication system and a method for assembling a dust-proof mechanism are disclosed. The system includes a chassis including an opening on a top side thereof; a PCB located within the chassis; a memory module removably installed on the PCB; and a cover removably coupled to the top side of the chassis. The opening is positioned and shaped such that the memory module is accessible via the opening for easy replacement. The method includes inserting a strip into the opening such that a space is formed between a wall of the opening and the strip; and inserting the memory module into the space formed between the wall of the opening and the strip such that another strip located at a first side of the memory module contacts the wall and the strip contacts a second side of the memory module. The memory module is replaceably coupled to the PCB.

    RULER DEVICE MODULE
    4.
    发明公开
    RULER DEVICE MODULE 审中-公开

    公开(公告)号:US20230345649A1

    公开(公告)日:2023-10-26

    申请号:US18344270

    申请日:2023-06-29

    CPC classification number: H05K5/0213 H05K7/1487 H05K5/0221 H05K5/023

    Abstract: A ruler device module is disclosed that includes top and bottom plates that are parallel, with the bottom plate defining a tray where the bottom plate extends beyond the top plate. The module further includes a pair of side plates on opposite sides of, and extending between, the top and bottom plate, with each side plate including a slot. Partitions are perpendicular to and between the top and bottom plates forming bays between adjacent partitions and the top and bottom plates. A handle structure is between the top and bottom plates and includes a handle configured to rotate between a recessed position and a use position. A nut structure is between the top plate and the bottom plate. The nut structure includes an aperture configured to engage a fastener of a chassis to secure the ruler device module to the chassis.

    RULER DEVICE MODULE
    5.
    发明公开
    RULER DEVICE MODULE 审中-公开

    公开(公告)号:US20230189457A1

    公开(公告)日:2023-06-15

    申请号:US17550819

    申请日:2021-12-14

    CPC classification number: H05K5/0213 H05K5/023 H05K5/0221 H05K7/1487

    Abstract: A ruler device module is disclosed that includes top and bottom plates that are parallel, with the bottom plate defining a tray where the bottom plate extends beyond the top plate. The module further includes a pair of side plates on opposite sides of, and extending between, the top and bottom plate, with each side plate including a slot. Partitions are perpendicular to and between the top and bottom plates forming bays between adjacent partitions and the top and bottom plates. A handle structure is between the top and bottom plates and includes a handle configured to rotate between a recessed position and a use position. A nut structure is between the top plate and the bottom plate. The nut structure includes an aperture configured to engage a fastener of a chassis to secure the ruler device module to the chassis.

    TOP COVER SYSTEM FOR A COMPUTER CHASSIS

    公开(公告)号:US20220377923A1

    公开(公告)日:2022-11-24

    申请号:US17325076

    申请日:2021-05-19

    Abstract: A chassis for a computing device includes a base component and a top cover. The base component includes guide slots therein. The top cover includes stamped protrusions extending from one or more side slider structures. The slider structurers extend downwardly from a top surface of the top cover. The stamped protrusions are unitary one-piece structures with the one or more side slider structures. The stamped protrusions correspond to respective guide slots of the base component such that the stamped protrusions are positioned in corresponding guide slots when the base component and the top cover are in a mating position.

Patent Agency Ranking