公开(公告)号：US11477915B2

公开(公告)日：2022-10-18

申请号：US17149151

申请日：2021-01-14

Applicant: QUANTA COMPUTER INC.

Inventor： Yi-Chieh Chen ,  Yueh-Chang Wu ,  Te-Chuan Wang ,  Tzu-Hsuan Hsu

IPC: H05K7/20

Abstract: A computing device includes a sealed computer chassis housing, a heat source, a heat spreader, and a thermal pad. The sealed computer chassis housing, defines an interior space and an exterior surface with a heat sink for the interior space. The heat source is disposed within the interior space. The heat spreader includes a plurality of thermally-conductive protrusions coupled to one or more components of the heat source by an intermediate thermally conductive layer. The thermal pad is positioned above and in thermal contact with the heat spreader. The thermal pad is positioned to contact an interior wall of the sealed computer chassis housing opposite to the heat sink.

公开(公告)号：US11622471B2

公开(公告)日：2023-04-04

申请号：US17304704

申请日：2021-06-24

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh Chen ,  Yueh-Chang Wu ,  Te-Chuan Wang ,  Tzu-Hsuan Hsu

IPC: H05K7/20 ,  G06F1/20

Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first cold plate, a connecting conduit, a second cold plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cold plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit transfers the coolant into the first cold plate. The connecting conduit is coupled at one end to the first outlet surface. The coolant flows from the first cold plate through the connecting conduit. The second cold plate has a second inlet surface and a second outlet surface, the connecting conduit being coupled at another end to the second inlet surface. The outlet conduit is coupled to the second outlet surface. The coolant flows from the second cold plate through the outlet conduit.

公开(公告)号：US11755084B2

公开(公告)日：2023-09-12

申请号：US17380845

申请日：2021-07-20

Applicant: QUANTA COMPUTER INC.

Inventor： Yi-Chieh Chen ,  Yueh-Chang Wu ,  Te-Chuan Wang ,  Tzu-Hsuan Hsu

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/206 ,  H05K7/20281 ,  G06F2200/201

Abstract: A cooling system for a rack of servers includes a plurality of cooling circuits, where each cooling circuit is coupled to a server of the rack. Each cooling circuit includes a plurality of cooling modules arranged in parallel. Each cooling module includes a cold plate having a cooling conduit passing therethrough, and a pump fluidly coupled to the cooling conduit. The cooling circuit further includes one or more valves fluidly interconnecting the plurality of cooling modules. Each of the one or more valves, when turned on, fluidly connects the cooling conduits of any two adjacent cooling modules. The cooling system further includes a first cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an inlet pipe, and a second cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an outlet pipe.