Liquid cooling module with movable radiators

    公开(公告)号:US11910563B2

    公开(公告)日:2024-02-20

    申请号:US17353301

    申请日:2021-06-21

    CPC classification number: H05K7/20263 H05K7/20254 H05K7/20272 H05K7/20772

    Abstract: A computing device comprises a housing, a heat-generating electronic component, at least one additional electronic component, and a liquid cooling module. The heat-generating component, the at least one additional electronic component, and the liquid cooling module are all positioned inside the housing. The liquid cooling module is configured to cool the heat-generating electronic component, and includes at least one movable radiator. The at least one movable radiator is configured to move between a first position and a second position. When the at least one movable radiator is in the first position, the at least one movable radiator blocks access to the at least one additional electronic component within the housing. When the at least one movable radiator is in the second position, the at least one movable radiator allows access to the at least one additional electronic component within the housing.

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