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公开(公告)号：US11937405B2
公开(公告)日：2024-03-19
申请号：US17387415
申请日：2021-07-28
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung Chen , Yu Nien Huang , Sin-Hong Lien , Jen-Mao Chen
IPC: H05K7/20
CPC classification number: H05K7/20663 , H05K7/20327 , H05K7/20354 , H05K7/202
Abstract: A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.
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公开(公告)号：US10219365B1
公开(公告)日：2019-02-26
申请号：US15903465
申请日：2018-02-23
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung Chen , Yi-Chieh Chen , Ming-Hung Tsai , Jen-Mao Chen
IPC: H05K7/20 , H05K1/02 , G06F1/20 , H01L23/367
Abstract: A circuit card assembly includes a circuit card, a plurality of components disposed on a first surface of the circuit card in a shadow arrangement, and a plurality of air-cooled heat sink structures disposed on each of the components. Each of the plurality of heat sink structures comprises a plurality of impedance zones arranged in series substantially perpendicular to the airflow path, where the plurality of impedance zones comprise a first impedance zone having a first air impedance, and a second impedance zone having a second air impedance less than the first air impedance. Further, the plurality of zones in the plurality of heat sink structures are aligned so that the first impedance zone in one of the plurality of heat sink structures does not overlap with the first impedance zone in another of the plurality of heat sink structures, relative to the airflow path.
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公开(公告)号：US20210172448A1
公开(公告)日：2021-06-10
申请号：US16706428
申请日：2019-12-06
Applicant: QUANTA COMPUTER INC.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Jen-Mao Chen
Abstract: A computing device has a fan housing that includes a dual rotor fan with a first rotor and a second rotor. The computing device also includes a controller communicatively coupled to the dual rotor fan. The controller is operable to detect a failure associated with the first rotor. In response to detecting the failure, the controller is operable to drive the second rotor at a higher speed than a fan-speed at which the second rotor was being driven before the failure.
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公开(公告)号：US10381761B2
公开(公告)日：2019-08-13
申请号：US15886409
申请日：2018-02-01
Applicant: QUANTA COMPUTER INC.
Inventor： Maw-Zan Jau , Jen-Mao Chen , Chun Chang
IPC: H05K7/02 , H05K7/04 , H01R12/72 , H01R12/67 , H01R12/70 , G06F13/40 , G06F1/18 , G06F1/20 , H05K7/14
Abstract: A circuit card assembly includes a circuit card having front and back ends, substantially parallel longitudinal edges between the front and back ends, and a bus connector extending from one of the longitudinal edges. The circuit card assembly includes a bracket structure providing a mounting surface, the mounting surface comprising a bracket for engaging with a plurality of adjacent ones of a plurality of bracket slots with openings at a fixed pitch. The circuit card assembly includes a connector assembly at the surface of said circuit card at the first end, with at least a first input/output (I/O) connector, and a second I/O connector in a stacked arrangement with respect to the surface of said circuit card, where the first I/O connector and the second I/O connector extend through the bracket and are separated by the fixed pitch.
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公开(公告)号：US11910563B2
公开(公告)日：2024-02-20
申请号：US17353301
申请日：2021-06-21
Applicant: Quanta Computer Inc.
Inventor： Jen-Mao Chen , Wei-En Tsai , Sin-Hong Lien , Jhih-Bin Guan
IPC: H05K7/20
CPC classification number: H05K7/20263 , H05K7/20254 , H05K7/20272 , H05K7/20772
Abstract: A computing device comprises a housing, a heat-generating electronic component, at least one additional electronic component, and a liquid cooling module. The heat-generating component, the at least one additional electronic component, and the liquid cooling module are all positioned inside the housing. The liquid cooling module is configured to cool the heat-generating electronic component, and includes at least one movable radiator. The at least one movable radiator is configured to move between a first position and a second position. When the at least one movable radiator is in the first position, the at least one movable radiator blocks access to the at least one additional electronic component within the housing. When the at least one movable radiator is in the second position, the at least one movable radiator allows access to the at least one additional electronic component within the housing.
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Patent Agency Ranking
6.发明公开公开(公告)号：US20240053805A1
公开(公告)日：2024-02-15
申请号：US18496828
申请日：2023-10-27
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung Chen , Yu-Nien Huang , Sin-Hong Lien , Jen-Mao Chen
CPC classification number: G06F1/20 , H05K7/20281 , H05K7/20272 , G06F2200/201
Abstract: A method and system controls cooling system leaks in a rack. The method includes monitoring leak detection sensors positioned at computer systems and below sections of a liquid conveyance system. In response to determining if a signal was received from one of the leak detection sensors that is indicative of a leak, the leak detection sensor and the corresponding one of the plurality of computer systems associated the received signal is determined. Power is disconnected to the corresponding one of the computer systems and a signal is transmitted to implement moving first and second valves from open to closed positions. The first valve is positioned within the liquid conveyance system between a hot rack manifold and a thermal contact structure associated with the computer system associated with the received signal. The second valve is positioned within the liquid conveyance system between a cool rack manifold and the thermal contact structure.
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7.发明授权公开(公告)号：US11540420B2
公开(公告)日：2022-12-27
申请号：US17186509
申请日：2021-02-26
Applicant: QUANTA COMPUTER INC.
Inventor： Jen-Mao Chen , Shao-Yu Chen , Sin-Hong Lien
Abstract: Embodiments of the disclosure relate to active cooling devices for cooling an electronic assembly positioned downstream in a computing system. In one embodiment, an electronic assembly positioned downstream of the computing system is disclosed. The electronic assembly includes a printed circuit board electrically connected to the computing system; an air duct disposed over the printed circuit board; and an active cooling device thermally coupled to the printed circuit board. The printed circuit board includes a transceiver socket configured to receive at least one optical transceiver and one or more heat-generating components disposed thereon. The at least one optical transceiver is configured to mate with an active optical cable.
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公开(公告)号：US11991867B2
公开(公告)日：2024-05-21
申请号：US17445239
申请日：2021-08-17
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung Chen , Yu-Nien Huang , Jen-Mao Chen , Shao-Yu Chen
IPC: H05K7/20
CPC classification number: H05K7/20781 , H05K7/20254 , H05K7/20272
Abstract: A closed-loop liquid cooling system includes a liquid coolant conduit, a cold plate, a pump and a heat exchanger. The liquid coolant conduit is in proximity to a heat-generating electrical component. The liquid coolant conduit allows circulation of a liquid coolant to extract heat therefrom. The liquid coolant conduit includes an inner portion that surrounds and contains the liquid coolant, and an outer portion configured to prevent or inhibit leakage of the liquid coolant from the inner portion and also detect any leakage from the inner portion. The cold plate is in thermal communication with the liquid coolant. The pump is configured to transport the liquid coolant in the liquid coolant conduit. The heat exchanger is coupled to the liquid coolant conduit to extract heat therefrom.
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公开(公告)号：US11868189B2
公开(公告)日：2024-01-09
申请号：US17514479
申请日：2021-10-29
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung Chen , Yu-Nien Huang , Sin-Hong Lien , Jen-Mao Chen
CPC classification number: G06F1/02 , H05K7/20272 , H05K7/20281 , G06F2200/201
Abstract: A method and system controls cooling system leaks in a rack. The method includes monitoring leak detection sensors positioned at computer systems and below sections of a liquid conveyance system. In response to determining if a signal was received from one of the leak detection sensors that is indicative of a leak, the leak detection sensor and the corresponding one of the plurality of computer systems associated the received signal is determined. Power is disconnected to the corresponding one of the computer systems and a signal is transmitted to implement moving first and second valves from open to closed positions. The first valve is positioned within the liquid conveyance system between a hot rack manifold and a thermal contact structure associated with the computer system associated with the received signal. The second valve is positioned within the liquid conveyance system between a cool rack manifold and the thermal contact structure.
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公开(公告)号：US11333157B2
公开(公告)日：2022-05-17
申请号：US16706428
申请日：2019-12-06
Applicant: QUANTA COMPUTER INC.
Inventor： Yi-Chieh Chen , Yueh-Chang Wu , Jen-Mao Chen
Abstract: A computing device has a fan housing that includes a dual rotor fan with a first rotor and a second rotor. The computing device also includes a controller communicatively coupled to the dual rotor fan. The controller is operable to detect a failure associated with the first rotor. In response to detecting the failure, the controller is operable to drive the second rotor at a higher speed than a fan-speed at which the second rotor was being driven before the failure.
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