公开(公告)号：US20160351307A1

公开(公告)日：2016-12-01

申请号：US14946155

申请日：2015-11-19

Applicant: RALEC ELECTRONIC CORPORATION

Inventor： WAN-PING WANG

IPC: H01C17/00 ,  H01C17/22 ,  H01C17/28 ,  H01C17/08

CPC classification number: H01C17/006 ,  B05C11/00 ,  B05D1/32 ,  B05D5/00 ,  H01C7/006 ,  H01C7/06 ,  H01C17/08 ,  H01C17/28

Abstract: A method for manufacturing a thin film chip resistor device includes the steps of: disposing a magnetic fixing member on a first surface of a substrate, and disposing a magnetic shadow mask on a second surface of the substrate opposite to the first surface, such that the magnetic shadow mask detachably and fixedly contacts the second surface of the substrate by virtue of an attractive magnetic force between the magnetic fixing member and the magnetic shadow mask; and depositing at least one resistor unit on the second surface of the substrate with the use of the magnetic shadow mask, the resistor unit including two separated first electrode elements and a resistor element that electrically interconnects the first electrode elements.

Abstract translation: 一种制造薄膜片式电阻器件的方法包括以下步骤：在基片的第一表面上设置磁性固定件，并在与第一表面相对的基片的第二表面上设置磁性掩模，使得 磁性荫罩借助于磁性固定构件和磁性荫罩之间的有吸引力的磁力而可拆卸地固定地接触基板的第二表面; 以及使用所述磁性掩模在所述衬底的所述第二表面上沉积至少一个电阻器单元，所述电阻器单元包括两个分离的第一电极元件和电连接所述第一电极元件的电阻元件。