公开(公告)号：US20140070120A1

公开(公告)日：2014-03-13

申请号：US14023027

申请日：2013-09-10

Applicant: Renesas Electronics Corporation

Inventor： Kazuhiro MITAMURA ,  Shigeru MORIBAYASHI ,  Ryuta YAGINUMA

IPC: H04B10/80

CPC classification number: H04B10/802

Abstract: A photocoupler comprises an input side lead frame; an output side lead frame disposed facing the input side lead frame with a gap therebetween; a light emitting device mounted on a face of the input side lead frame facing the output side lead frame side; a light receiving device mounted on a face of the output side lead frame facing the input side lead frame side, opposite to and having a gap with the light emitting device; and a protrusion disposed on at least a part of an area around the light receiving device on the output side lead frame and being formed of conductive bonding wire or a bump, protruding to the input side lead frame side.

Abstract translation: 光电耦合器包括输入侧引线框架; 输出侧引线框架，其面向所述输入侧引线框架设置，其间具有间隙; 安装在所述输入侧引线框架的面向所述输出侧引线框架侧的面上的发光器件; 安装在输出侧引线框架的面向输入侧引线框架侧的与发光器件相对并且与发光器件具有间隙的光接收器件; 以及设置在输出侧引线框架周围的光接收装置周围的区域的至少一部分上的突起，并且由导电接合线或凸块形成，突出到输入侧引线框架侧。

公开(公告)号：US20160087729A1

公开(公告)日：2016-03-24

申请号：US14960768

申请日：2015-12-07

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Kazuhiro MITAMURA ,  Shigeru MORIBAYASHI ,  Ryuta YAGINUMA

IPC: H04B10/80

CPC classification number: H04B10/802

Abstract: A photocoupler comprises an input side lead frame; an output side lead frame disposed facing the input side lead frame with a gap therebetween; a light emitting device mounted on a face of the input side lead frame facing the output side lead frame side; a light receiving device mounted on a face of the output side lead frame facing the input side lead frame side, opposite to and having a gap with the light emitting device; and a protrusion disposed on at least a part of an area around the light receiving device on the output side lead frame and being formed of conductive bonding wire or a bump, protruding to the input side lead frame side.

Abstract translation: 光电耦合器包括输入侧引线框架; 输出侧引线框架，其面向所述输入侧引线框架设置，其间具有间隙; 安装在所述输入侧引线框架的面向所述输出侧引线框架侧的面上的发光器件; 安装在输出侧引线框架的面向输入侧引线框架侧的与发光器件相对并且与发光器件具有间隙的光接收器件; 以及设置在输出侧引线框架周围的光接收装置周围的区域的至少一部分上的突起，并且由导电接合线或凸块形成，突出到输入侧引线框架侧。

公开(公告)号：US20140077588A1

公开(公告)日：2014-03-20

申请号：US13958764

申请日：2013-08-05

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Shigeru MORIBAYASHI

IPC: H02J5/00

CPC classification number: H02J5/00 ,  H04L25/0272 ,  H04L25/4906

Abstract: A semiconductor device includes a first nonlinear element, an differential amplifier that generates a differential signal from a signal output by the first nonlinear element; a first and second insulating elements that are connected to a non-inverting signal output terminal and an inverting signal output terminal of the differential amplifier, respectively; first to third nonlinear elements each outputting a first logic level if the received signal is equal to or larger than a given threshold value, and outputting a second logic level if the received signal is smaller than the given threshold value; and a logic circuit that outputs the logic level output by the second nonlinear element if the logic levels output by the second and third nonlinear elements are different from each other, and makes the logic level of the output signal unchangeable when the second and third nonlinear elements output the same logic level.

Abstract translation: 半导体器件包括第一非线性元件，差分放大器，其从由第一非线性元件输出的信号产生差分信号; 分别连接到差分放大器的非反相信号输出端和反相信号输出端的第一和第二绝缘元件; 第一至第三非线性元件，如果接收信号等于或大于给定阈值，则输出第一逻辑电平，如果接收信号小于给定阈值，则输出第二逻辑电平; 以及如果由第二和第三非线性元件输出的逻辑电平彼此不同，则输出由第二非线性元件输出的逻辑电平的逻辑电路，并且当第二和第三非线性元件 输出相同的逻辑电平。