公开(公告)号：US20140070120A1

公开(公告)日：2014-03-13

申请号：US14023027

申请日：2013-09-10

Applicant: Renesas Electronics Corporation

Inventor： Kazuhiro MITAMURA ,  Shigeru MORIBAYASHI ,  Ryuta YAGINUMA

IPC: H04B10/80

CPC classification number: H04B10/802

Abstract: A photocoupler comprises an input side lead frame; an output side lead frame disposed facing the input side lead frame with a gap therebetween; a light emitting device mounted on a face of the input side lead frame facing the output side lead frame side; a light receiving device mounted on a face of the output side lead frame facing the input side lead frame side, opposite to and having a gap with the light emitting device; and a protrusion disposed on at least a part of an area around the light receiving device on the output side lead frame and being formed of conductive bonding wire or a bump, protruding to the input side lead frame side.

Abstract translation: 光电耦合器包括输入侧引线框架; 输出侧引线框架，其面向所述输入侧引线框架设置，其间具有间隙; 安装在所述输入侧引线框架的面向所述输出侧引线框架侧的面上的发光器件; 安装在输出侧引线框架的面向输入侧引线框架侧的与发光器件相对并且与发光器件具有间隙的光接收器件; 以及设置在输出侧引线框架周围的光接收装置周围的区域的至少一部分上的突起，并且由导电接合线或凸块形成，突出到输入侧引线框架侧。

公开(公告)号：US20160163615A1

公开(公告)日：2016-06-09

申请号：US14941721

申请日：2015-11-16

Applicant: Renesas Electronics Corporation

Inventor： Kazuhiro MITAMURA ,  Koji BANDO ,  Yukihiro SATO ,  Takamitsu KANAZAWA

IPC: H01L23/36 ,  H02M7/537 ,  H01L29/861 ,  H01L23/31 ,  H01L27/06 ,  H01L29/739

CPC classification number: H02M7/537 ,  H01L23/3107 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L27/0664 ,  H01L29/0615 ,  H01L29/0619 ,  H01L29/7397 ,  H01L29/861 ,  H01L29/8611 ,  H01L2224/0603 ,  H01L2224/29101 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/0781 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H02M7/003 ,  H02P27/06 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/014

Abstract: For example, a semiconductor device has a lead connected to a second portion of a chip mounting part on which a semiconductor chip to be a heat source is mounted and a lead connected to a third portion of the chip mounting part on which the semiconductor chip to be the heat source is mounted. Further, each of the leads has a protruding portion protruding from a sealing member. In this manner, it is possible to enhance a heat dissipation characteristic of the semiconductor device.

Abstract translation: 例如，半导体器件具有连接到其上安装有作为热源的半导体芯片的芯片安装部的第二部分的引线和连接到芯片安装部的第三部分的引线，半导体芯片上的半导体芯片 作为热源安装。 此外，每个引线具有从密封构件突出的突出部分。 以这种方式，可以提高半导体器件的散热特性。

公开(公告)号：US20160148859A1

公开(公告)日：2016-05-26

申请号：US14862102

申请日：2015-09-22

Applicant: Renesas Electronics Corporation

Inventor： Akira MUTO ,  Koji BANDO ,  Yukihiro SATO ,  Kazuhiro MITAMURA

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49575 ,  B60L3/003 ,  B60L11/1803 ,  B60L15/007 ,  B60L2220/12 ,  B60L2240/525 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49565 ,  H01L23/544 ,  H01L23/564 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L2223/54406 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/29116 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40139 ,  H01L2224/40245 ,  H01L2224/40998 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/77704 ,  H01L2224/78704 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/838 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/84136 ,  H01L2224/84138 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/8485 ,  H01L2224/84862 ,  H01L2224/8585 ,  H01L2224/92147 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  Y02T10/645 ,  Y02T10/7005 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/05559 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.

Abstract translation: 假设在引线框架中设置一对悬挂部件，并且夹子包括主体部分和一对延伸部分，所述一对延伸部分被安装并支撑在所述一对悬挂部分上。 因此，夹子安装在一个引线（一点）上，一对悬挂部分（两点）和夹子被三个点支撑。

公开(公告)号：US20160087729A1

公开(公告)日：2016-03-24

申请号：US14960768

申请日：2015-12-07

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Kazuhiro MITAMURA ,  Shigeru MORIBAYASHI ,  Ryuta YAGINUMA

IPC: H04B10/80

CPC classification number: H04B10/802

Abstract: A photocoupler comprises an input side lead frame; an output side lead frame disposed facing the input side lead frame with a gap therebetween; a light emitting device mounted on a face of the input side lead frame facing the output side lead frame side; a light receiving device mounted on a face of the output side lead frame facing the input side lead frame side, opposite to and having a gap with the light emitting device; and a protrusion disposed on at least a part of an area around the light receiving device on the output side lead frame and being formed of conductive bonding wire or a bump, protruding to the input side lead frame side.

Abstract translation: 光电耦合器包括输入侧引线框架; 输出侧引线框架，其面向所述输入侧引线框架设置，其间具有间隙; 安装在所述输入侧引线框架的面向所述输出侧引线框架侧的面上的发光器件; 安装在输出侧引线框架的面向输入侧引线框架侧的与发光器件相对并且与发光器件具有间隙的光接收器件; 以及设置在输出侧引线框架周围的光接收装置周围的区域的至少一部分上的突起，并且由导电接合线或凸块形成，突出到输入侧引线框架侧。

公开(公告)号：US20230066512A1

公开(公告)日：2023-03-02

申请号：US17841196

申请日：2022-06-15

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Keita TSUCHIYA ,  Shuuichi KARIYAZAKI ,  Kazuhiro MITAMURA

IPC: H01L23/498 ,  H01L23/367 ,  H01L23/66 ,  H01P3/08

Abstract: A wiring substrate includes: a first insulating layer; a ground plane formed on the first insulating layer; a second insulating layer formed on the first insulating layer such that the ground plane is covered with the second insulating layer; a first signal wiring formed on the second insulating layer; a third insulating layer formed on the second insulating layer such that the first signal wiring is covered with the third insulating layer; and a second signal wiring formed on the third insulating layer and electrically connected with the first signal wiring. The first signal wiring is arranged in a region overlapping with a portion of a heat radiating plate. The second signal wiring is not arranged in the region. The ground plane has an opening portion located at a position overlapping with the first signal wiring. The opening portion is formed so as to extend along the first signal wiring.

公开(公告)号：US20170103940A1

公开(公告)日：2017-04-13

申请号：US15385637

申请日：2016-12-20

Applicant: Renesas Electronics Corporation

Inventor： Akira MUTO ,  Koji BANDO ,  Yukihiro SATO ,  Kazuhiro MITAMURA

IPC: H01L23/495 ,  H01L23/544 ,  H01L23/31

CPC classification number: H01L23/49575 ,  B60L3/003 ,  B60L11/1803 ,  B60L15/007 ,  B60L2220/12 ,  B60L2240/525 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49565 ,  H01L23/544 ,  H01L23/564 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L2223/54406 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/29116 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40139 ,  H01L2224/40245 ,  H01L2224/40998 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/77704 ,  H01L2224/78704 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/838 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/84136 ,  H01L2224/84138 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/8485 ,  H01L2224/84862 ,  H01L2224/8585 ,  H01L2224/92147 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  Y02T10/645 ,  Y02T10/7005 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/05559 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.

公开(公告)号：US20240203812A1

公开(公告)日：2024-06-20

申请号：US18067375

申请日：2022-12-16

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Takamichi HOSOKAWA ,  Kazuhiro MITAMURA ,  Fumio MURAKAMI ,  Yuji KAYASHIMA ,  Yoshihiro MASUMURA

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/29 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/315 ,  H01L23/295 ,  H01L23/49838 ,  H01L23/49861 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/32245 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48137 ,  H01L2224/48245 ,  H01L2224/73265 ,  H01L2924/1811 ,  H01L2924/1815 ,  H01L2924/182 ,  H01L2924/186 ,  H01L2924/30205 ,  H01L2924/37001

Abstract: A semiconductor device includes a first chip mounting portion, a second chip mounting portion, a first semiconductor chip mounted on the first chip mounting portion, a second semiconductor chip mounted on the second chip mounting portion, a plurality of lead portions, and a sealing portion sealing them. The sealing portion has a first main surface and a second main surface opposite the first main surface. A groove portion is formed in the sealing portion at the first main surface. At the first main surface of the sealing portion, each of the first chip mounting portion and the second chip mounting portion is exposed from the sealing portion. At the first main surface of the sealing portion, the groove portion is formed between an exposed portion of the first chip mounting portion and an exposed portion of the second chip mounting portion.