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公开(公告)号：US20220165638A1
公开(公告)日：2022-05-26
申请号：US17517908
申请日：2021-11-03
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor： Toshihiko AKIBA , Yusuke TANUMA
IPC: H01L23/367 , H01L23/10 , H01L23/04 , H01L23/00
Abstract: A semiconductor device includes: a wiring substrate; a semiconductor chip mounted on the wiring substrate; a heat release sheet arranged on the semiconductor chip to cover the entire semiconductor chip and having a larger area than an area of the semiconductor chip; and a cover member which covers the semiconductor chip and the heat release sheet and to which the heat release sheet is fixed. The cover member has a first portion facing the semiconductor chip, a flange portion arranged in a periphery of the first portion and bonded and fixed onto the wiring substrate, and a second portion arranged between the first portion and the flange portion. In a plan view of the cover member viewed from the heat release sheet, the heat release sheet is bonded/fixed to the cover member through a bonding member partially arranged between the heat release sheet and the cover member.
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公开(公告)号：US20170053846A1
公开(公告)日：2017-02-23
申请号：US15220438
申请日：2016-07-27
Applicant: Renesas Electronics Corporation
Inventor： Yosuke KATSURA , Yusuke TANUMA
Abstract: A semiconductor device includes a memory component, which is a semiconductor component (a semiconductor chip or a semiconductor package), to be mounted over an upper surface of a wiring substrate. In addition, in the upper surface, a distance between the memory component and a first substrate side of the upper surface is smaller than a distance between the memory component and a second substrate side of the upper surface. In addition, in the upper surface, a dam portion is formed between the memory component and the first substrate side.
Abstract translation: 半导体器件包括作为半导体部件（半导体芯片或半导体封装）的存储部件，被安装在布线基板的上表面上。 此外，在上表面中，存储部件与上表面的第一基板侧之间的距离小于上表面的存储部件与第二基板侧之间的距离。 此外，在上表面中，在存储部件和第一基板侧之间形成有阻挡部。
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