公开(公告)号：US20190315501A1

公开(公告)日：2019-10-17

申请号：US16386968

申请日：2019-04-17

Applicant: Raytheon Company ,  ThermAvant Technologies, LLC

Inventor： Tuan L. Duong ,  Adam D. Leeds ,  James E. Benedict ,  Joseph A. Boswell ,  Daniel A. Pounds

IPC: B64G1/58 ,  B64G1/10 ,  F03G7/06 ,  F28D15/02 ,  F28F3/12

Abstract: An apparatus includes a structure configured to receive thermal energy and to reject the thermal energy into an external environment. The structure includes a lid and a body. The structure also includes (i) multiple inline and interconnected thermomechanical regions and (ii) one or more oscillating heat pipes embedded in at least some of the thermomechanical regions. Different portions of at least one of the lid and the body form the thermomechanical regions. The one or more oscillating heat pipes are configured to transfer the thermal energy between different ones of the thermomechanical regions. At least one of the thermomechanical regions includes one or more shape-memory materials configured to cause a shape of the structure to change. Each of the one or more oscillating heat pipes includes at least one channel in the structure.

公开(公告)号：US20190315500A1

公开(公告)日：2019-10-17

申请号：US16385546

申请日：2019-04-16

Applicant: Raytheon Company

Inventor： Tuan L. Duong ,  Adam D. Leeds ,  James E. Benedict

IPC: B64G1/58 ,  F28F5/00 ,  F42B15/34 ,  B64G1/10 ,  F03G7/06

Abstract: A system includes a flight vehicle and one or more deployable radiators. Each deployable radiator includes a structure configured to receive thermal energy and to reject the thermal energy into an external environment. The structure includes (i) multiple inline and interconnected thermomechanical regions and (ii) one or more thermal energy transfer devices embedded in at least some of the thermomechanical regions. The one or more thermal energy transfer devices are configured to transfer the thermal energy between different ones of the thermomechanical regions. At least one of the thermomechanical regions includes one or more shape-memory materials configured to cause a shape of the structure to change. The thermomechanical regions may include one or more heat input regions configured to receive the thermal energy, one or more heat rejection regions configured to reject the thermal energy into the external environment, and one or more morphable regions including the one or more shape-memory materials and configured to change shape.