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公开(公告)号:US08172376B2
公开(公告)日:2012-05-08
申请号:US12026138
申请日:2008-02-05
申请人: Roi Nathan , Haggai Karlinski , Gil Fisher
发明人: Roi Nathan , Haggai Karlinski , Gil Fisher
CPC分类号: B41J2/17503 , B41J2/14 , B41J2002/14419 , B41J2002/14491 , B41J2202/12 , B41J2202/19 , B41J2202/20
摘要: Disclosed is an inkjet print head array with improved ink supply system. The system includes an ink manifold having at least two ink supply channels, a plurality of print head modules disposed along ink supply channels and forming the array, with each of the print head modules having at least two ink inlet ports. The ports are in fluid communication with the ink supply channels. Each of the ink supply channels supplies ink to each of the ports at a different flow rate, although the resulting ink supply flow rate is equal for each print head module.
摘要翻译: 公开了一种具有改进的供墨系统的喷墨打印头阵列。 该系统包括具有至少两个供墨通道的油墨歧管,沿油墨供应通道设置并形成阵列的多个打印头模块,其中每个打印头模块具有至少两个油墨入口。 端口与供墨通道流体连通。 每个墨水供应通道以不同的流量向每个端口供应墨水,尽管所得的墨水供应流量对于每个打印头模块是相同的。
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公开(公告)号:US07589420B2
公开(公告)日:2009-09-15
申请号:US11447333
申请日:2006-06-06
申请人: Haggai Karlinski , Gil Fisher , Roi Nathan , Ilan Weiss
发明人: Haggai Karlinski , Gil Fisher , Roi Nathan , Ilan Weiss
IPC分类号: H01L23/66
CPC分类号: B41J2/14201 , B41J2002/14362 , Y10T156/10
摘要: An ink jet print head includes a silicon ink jet chip, a print head holder, configured to carry and support the silicon chip, and a glass plate, bonded between the silicon chip and the print head holder. The ink jet chip has a coefficient of thermal expansion αs. The print head holder has a holder wall thickness, and a coefficient of thermal expansion αh that is substantially different from αs. The glass plate has a coefficient of thermal expansion αg that is substantially similar to αs, and a thickness at least as great as the holder wall thickness, whereby stress created by differential thermal expansion between the silicon chip and the holder is attenuated by the glass plate.
摘要翻译: 喷墨打印头包括硅喷墨芯片,配置为承载和支撑硅芯片的打印头保持器,以及粘合在硅芯片和打印头保持器之间的玻璃板。 喷墨芯片具有热膨胀系数α。 打印头保持器具有保持器壁厚度和与阿尔法显着不同的热膨胀系数alphah。 玻璃板具有基本上类似于α的热膨胀系数,并且至少与保持器壁厚度一样大的厚度,由此硅芯片和保持器之间由差的热膨胀产生的应力被玻璃板衰减 。
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公开(公告)号:US20080068425A1
公开(公告)日:2008-03-20
申请号:US11520876
申请日:2006-09-14
申请人: Roi Nathan , Gil Fisher , Haggai Karlinski , Aya Blumberg , Ilan Weiss
发明人: Roi Nathan , Gil Fisher , Haggai Karlinski , Aya Blumberg , Ilan Weiss
CPC分类号: B41J2/14233 , B41J2002/14379
摘要: A fluid ejection device includes a substrate having a fluid channel, a flexible membrane supported by the substrate and extended a length of the fluid channel, an actuator provided on a first portion of the flexible membrane, and a reinforcement member provided on a second portion of the flexible membrane such that the actuator is adapted to deflect the first portion of the flexible membrane relative to the fluid channel, and the reinforcement member supports the second portion of the flexible membrane.
摘要翻译: 流体喷射装置包括具有流体通道的基板,由基板支撑并延伸一段长度的流体通道的柔性膜,设置在柔性膜的第一部分上的致动器,以及设置在柔性膜的第二部分上的加强件 所述柔性膜使得所述致动器适于相对于所述流体通道偏转所述柔性膜的所述第一部分,并且所述加强构件支撑所述柔性膜的第二部分。
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公开(公告)号:US20100032075A1
公开(公告)日:2010-02-11
申请号:US12538655
申请日:2009-08-10
申请人: Haggai Karlinski , Gil Fisher , Roi Nathan , Ilan Weiss
发明人: Haggai Karlinski , Gil Fisher , Roi Nathan , Ilan Weiss
IPC分类号: B32B37/00
CPC分类号: B41J2/14201 , B41J2002/14362 , Y10T156/10
摘要: A method for reducing stress between a silicon chip and a bonded mounting structure having a coefficient of thermal expansion substantially different from a coefficient of thermal expansion of the silicon chip includes the step of bonding a thermal stress-attenuating layer between the silicon chip and the mounting structure. The thermal stress-attenuating layer has a coefficient of thermal expansion that is substantially similar to the coefficient of thermal expansion of the silicon chip.
摘要翻译: 减小硅芯片和具有与硅芯片的热膨胀系数不同的热膨胀系数的结合安装结构的应力的方法包括在硅芯片和安装件之间粘接热应力衰减层的步骤 结构体。 热应力衰减层的热膨胀系数基本上类似于硅芯片的热膨胀系数。
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公开(公告)号:US20090135219A1
公开(公告)日:2009-05-28
申请号:US11997682
申请日:2006-07-31
申请人: Roi Nathan , Haggai Karlinski , Amit Henig , Gil Fisher
发明人: Roi Nathan , Haggai Karlinski , Amit Henig , Gil Fisher
IPC分类号: B41J29/377
CPC分类号: B41J2/1408 , B41J29/377 , B41J2202/08
摘要: A compliant cooling conduit is employed to extract heat from an inkjet print head array. The cooler conduit is implemented as a flexible conduit placed between the heat emitting surfaces. Cooling fluid pressure presses the conduit to the heat emitting parts of the print head modules. When fluid pressure is removed the conduit collapses and provides convenient access for print head service.
摘要翻译: 采用柔性冷却导管从喷墨打印头阵列提取热量。 冷却器管道被实现为放置在发热表面之间的柔性导管。 冷却液压力将管道压到打印头模块的发热部分。 当流体压力消除时,管道塌陷并提供方便的打印头服务。
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公开(公告)号:US20080204533A1
公开(公告)日:2008-08-28
申请号:US12026138
申请日:2008-02-05
申请人: Roi Nathan , Haggai Karlinski , Gil Fisher
发明人: Roi Nathan , Haggai Karlinski , Gil Fisher
IPC分类号: B41J2/175
CPC分类号: B41J2/17503 , B41J2/14 , B41J2002/14419 , B41J2002/14491 , B41J2202/12 , B41J2202/19 , B41J2202/20
摘要: Disclosed is an inkjet print head array with improved ink supply system. The system includes an ink manifold having at least two ink supply channels, a plurality of print head modules disposed along ink supply channels and forming the array, with each of the print head modules having at least two ink inlet ports. The ports are in fluid communication with the ink supply channels. Each of the ink supply channels supplies ink to each of the ports at a different flow rate, although the resulting ink supply flow rate is equal for each print head module.
摘要翻译: 公开了一种具有改进的供墨系统的喷墨打印头阵列。 该系统包括具有至少两个供墨通道的油墨歧管,沿油墨供应通道设置并形成阵列的多个打印头模块,其中每个打印头模块具有至少两个油墨入口。 端口与供墨通道流体连通。 每个墨水供应通道以不同的流量向每个端口供应墨水,尽管所得的墨水供应流量对于每个打印头模块是相同的。
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公开(公告)号:US08388778B2
公开(公告)日:2013-03-05
申请号:US12538655
申请日:2009-08-10
申请人: Haggai Karlinski , Gil Fisher , Roi Nathan , Ilan Weiss
发明人: Haggai Karlinski , Gil Fisher , Roi Nathan , Ilan Weiss
IPC分类号: B41J2/14
CPC分类号: B41J2/14201 , B41J2002/14362 , Y10T156/10
摘要: A method for reducing stress between a silicon chip and a bonded mounting structure having a coefficient of thermal expansion substantially different from a coefficient of thermal expansion of the silicon chip includes the step of bonding a thermal stress-attenuating layer between the silicon chip and the mounting structure. The thermal stress-attenuating layer has a coefficient of thermal expansion that is substantially similar to the coefficient of thermal expansion of the silicon chip.
摘要翻译: 一种减小硅芯片和具有与硅芯片的热膨胀系数不同的热膨胀系数的结合安装结构的应力的方法包括在硅芯片和安装件之间接合热应力衰减层的步骤 结构体。 热应力衰减层的热膨胀系数基本上类似于硅芯片的热膨胀系数。
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公开(公告)号:US20080068430A1
公开(公告)日:2008-03-20
申请号:US11520877
申请日:2006-09-14
申请人: Roi Nathan , Gil Fisher , Haggai Karlinski , Aya Blumberg , Ilan Weiss
发明人: Roi Nathan , Gil Fisher , Haggai Karlinski , Aya Blumberg , Ilan Weiss
IPC分类号: B41J2/17
CPC分类号: B41J2/14233 , B41J2002/14419 , B41J2202/11
摘要: A fluid ejection device includes a substrate having a fluid channel including a fluid inlet and a fluid outlet, a flexible membrane supported by the substrate and extended a length of the fluid channel, an actuator provided on the flexible membrane, and a constriction provided within the fluid channel between the fluid inlet and the fluid outlet, such that the actuator is adapted to deflect the flexible membrane relative to the fluid channel, and the constriction supports the flexible membrane between the fluid inlet and the fluid outlet.
摘要翻译: 流体喷射装置包括具有包括流体入口和流体出口的流体通道的基底,由基底支撑并延伸一段长度的流体通道的柔性膜,设置在柔性膜上的致动器以及设置在该柔性膜内的收缩部 流体入口和流体出口之间的流体通道,使得致动器适于相对于流体通道偏转柔性膜,并且收缩部将柔性膜支撑在流体入口和流体出口之间。
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公开(公告)号:US08042913B2
公开(公告)日:2011-10-25
申请号:US11520876
申请日:2006-09-14
申请人: Roi Nathan , Gil Fisher , Haggai Karlinski , Aya Blumberg , Ilan Weiss
发明人: Roi Nathan , Gil Fisher , Haggai Karlinski , Aya Blumberg , Ilan Weiss
IPC分类号: B41J2/045
CPC分类号: B41J2/14233 , B41J2002/14379
摘要: A fluid ejection device includes a substrate having a fluid channel, a flexible membrane supported by the substrate and extended a length of the fluid channel, an actuator provided on a first portion of the flexible membrane, and a reinforcement member provided on a second portion of the flexible membrane such that the actuator is adapted to deflect the first portion of the flexible membrane relative to the fluid channel, and the reinforcement member supports the second portion of the flexible membrane.
摘要翻译: 流体喷射装置包括具有流体通道的基板,由基板支撑并延伸一段长度的流体通道的柔性膜,设置在柔性膜的第一部分上的致动器,以及设置在柔性膜的第二部分上的加强件 所述柔性膜使得所述致动器适于相对于所述流体通道偏转所述柔性膜的所述第一部分,并且所述加强构件支撑所述柔性膜的第二部分。
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公开(公告)号:US07914125B2
公开(公告)日:2011-03-29
申请号:US11520877
申请日:2006-09-14
申请人: Roi Nathan , Gil Fisher , Haggai Karlinski , Aya Blumberg , Ilan Weiss
发明人: Roi Nathan , Gil Fisher , Haggai Karlinski , Aya Blumberg , Ilan Weiss
CPC分类号: B41J2/14233 , B41J2002/14419 , B41J2202/11
摘要: A fluid ejection device includes a substrate having a fluid channel including a fluid inlet and a fluid outlet, a flexible membrane supported by the substrate and extended a length of the fluid channel, an actuator provided on the flexible membrane, and a constriction provided within the fluid channel between the fluid inlet and the fluid outlet, such that the actuator is adapted to deflect the flexible membrane relative to the fluid channel, and the constriction supports the flexible membrane between the fluid inlet and the fluid outlet.
摘要翻译: 流体喷射装置包括具有包括流体入口和流体出口的流体通道的基底,由基底支撑并延伸一段长度的流体通道的柔性膜,设置在柔性膜上的致动器以及设置在该柔性膜内的收缩部 流体入口和流体出口之间的流体通道,使得致动器适于相对于流体通道偏转柔性膜,并且收缩部将柔性膜支撑在流体入口和流体出口之间。
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