公开(公告)号：US11513018B2

公开(公告)日：2022-11-29

申请号：US17039222

申请日：2020-09-30

Applicant: Rosemount Inc.

Inventor： Jacob Daniel Holm ,  Benjamin Hammerlind Jaffray ,  Glen Rodney Edwards ,  Ryan Thomas Lindsey ,  Paul Curtis Sundet ,  Timothy R Meschke ,  George Charles Hausler ,  Christopher Lee Eriksen

IPC: H05K5/00 ,  G01L19/14

Abstract: Embodiments of the present disclosure are directed to field device housing assemblies and field devices that include the housing assemblies. One embodiment of the field device housing assembly includes a main housing, a cover having a proximal end connected to the main housing, a transparent panel and a retainer ring. An interior wall of the cover includes a threaded section that is concentric to a central axis, and a flange extending radially inward from the interior wall toward the central axis. The transparent panel is received within a socket defined by the interior wall and the flange. The retainer ring is secured to the threaded section of the interior wall. The transparent panel is clamped between the retainer ring and the flange.

公开(公告)号：US20230096421A1

公开(公告)日：2023-03-30

申请号：US17486141

申请日：2021-09-27

Applicant: Rosemount Inc.

Inventor： Andrew John Wagener ,  Jacob Daniel Holm ,  Sydney Jane Jones

IPC: G01L19/00 ,  F16L23/16 ,  H01B17/56

Abstract: An industrial process field device includes a pressure sensor, and a housing containing the pressure sensor. The housing includes a base having a base interface and a first base process opening. A flange is attached to the base and includes a flange interface having a first flange process opening. A pressure at the first flange process opening is communicated to the pressure sensor through the first base process opening. A first gasket process opening of a gasket is aligned with the first base process opening and the first flange process opening. A first surface of the gasket engages the base interface, and a second surface of the gasket engages the flange interface. A dielectric insulation system includes at least one dielectric layer that insulates the housing from electrical currents conducted through the flange. Each dielectric layer includes a layer of ceramic material, an anodized layer, or a plastic overmold.

公开(公告)号：US20220099516A1

公开(公告)日：2022-03-31

申请号：US17039222

申请日：2020-09-30

Applicant: Rosemount Inc.

Inventor： Jacob Daniel Holm ,  Benjamin Hammerlind Jaffray ,  Glen Rodney Edwards ,  Ryan Thomas Lindsey ,  Paul Curtis Sundet ,  Timothy R. Meschke

IPC: G01L19/14 ,  H05K5/00

Abstract: Embodiments of the present disclosure are directed to field device housing assemblies and field devices that include the housing assemblies. One embodiment of the field device housing assembly includes a main housing, a cover having a proximal end connected to the main housing, a transparent panel and a retainer ring. An interior wall of the cover includes a threaded section that is concentric to a central axis, and a flange extending radially inward from the interior wall toward the central axis. The transparent panel is received within a socket defined by the interior wall and the flange. The retainer ring is secured to the threaded section of the interior wall. The transparent panel is clamped between the retainer ring and the flange.

公开(公告)号：US20240179854A1

公开(公告)日：2024-05-30

申请号：US18071788

申请日：2022-11-30

Applicant: Rosemount Inc.

Inventor： Jacob Daniel Holm ,  George Charles Hausler ,  Andrew John Wagener

IPC: H05K5/00 ,  H05K5/02 ,  H05K7/14

CPC classification number: H05K5/0056 ,  H05K5/0217 ,  H05K7/1417

Abstract: A process variable transmitter is provided. The process variable transmitter includes a process variable sensor, and an electronics board having circuitry electrically coupled to the process variable sensor. The process variable transmitter also includes a shroud that holds the electronics board, and at least one stop feature to provide vibration damping. A method of manufacturing a process variable transmitter is provided. The method includes providing a process variable sensor. The method also includes providing an electronics board having circuitry configured to electrically couple to the process variable sensor. The method further includes forming a shroud to hold the electronics board, and forming at least one stop feature to support the electronics board when the electronics board is in the shroud.

公开(公告)号：US11808647B2

公开(公告)日：2023-11-07

申请号：US17486141

申请日：2021-09-27

Applicant: Rosemount Inc.

Inventor： Andrew John Wagener ,  Jacob Daniel Holm ,  Sydney Jane Jones

IPC: G01L19/00 ,  F16L23/16 ,  H01B17/56

CPC classification number: G01L19/0007 ,  F16L23/162 ,  H01B17/56

Abstract: An industrial process field device includes a pressure sensor, and a housing containing the pressure sensor. The housing includes a base having a base interface and a first base process opening. A flange is attached to the base and includes a flange interface having a first flange process opening. A first gasket process opening of a gasket is aligned with the first base process opening and the first flange process opening. A first surface of the gasket engages the base interface, and a second surface of the gasket engages the flange interface. A dielectric insulation system includes at least one dielectric layer that insulates the housing from electrical currents conducted through the flange. Each dielectric layer includes a layer of ceramic material, an anodized layer, or a plastic overmold, which improve a maximum working pressure of the field device.