公开(公告)号：US10229767B2

公开(公告)日：2019-03-12

申请号：US13740092

申请日：2013-01-11

Applicant: SABIC Global Technologies B.V.

Inventor： Anton Kumanan ,  Reema Sinha ,  Susanta Mitra ,  Uchiyama Tatsuya

IPC: H01B1/04 ,  C08L69/00 ,  H01B1/24 ,  C08L67/02 ,  C08K3/04 ,  C08L23/06 ,  C08L25/12

Abstract: The present disclosure relates to thermoplastic electrostatic dissipative (ESD) composites. The disclosed compositions comprise a thermoplastic resin phase and a filler composition comprising a conductive carbon black and a non-conductive polymer, dispersed within the thermoplastic resin phase. Also disclosed are methods for the manufacture of the disclosed composites and articles of manufacture comprising same.