公开(公告)号：US20190170788A1

公开(公告)日：2019-06-06

申请号：US16130699

申请日：2018-09-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Duck Mahn Oh ,  Sung Yoon Ryu ,  Young Hoon Sohn ,  Chung Sam Jun ,  Yun Jung Jee

IPC: G01Q60/16 ,  G02B21/00 ,  G01Q80/00

CPC classification number: G01Q60/16 ,  G01Q10/06 ,  G01Q60/30 ,  G01Q80/00 ,  G02B21/002

Abstract: A scanning probe inspector comprises: a probe that includes a cantilever and a tip whose length corresponds to a depth of a trench that is formed in a wafer; a trench detector that acquires location information of the trench using the probe, where the location information includes depth information of the trench; a controller that inserts the tip into a first point where there exists a trench based on the location information of the trench, and moves the tip through the trench using the location information of the trench; and a defect detector that detects a presence of a defect in a sidewall of the trench as the tip is moved through the trench.

公开(公告)号：US10585115B2

公开(公告)日：2020-03-10

申请号：US16130699

申请日：2018-09-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Duck Mahn Oh ,  Sung Yoon Ryu ,  Young Hoon Sohn ,  Chung Sam Jun ,  Yun Jung Jee

IPC: G01Q60/00 ,  G01Q60/16 ,  G01Q80/00 ,  G02B21/00

Abstract: A scanning probe inspector comprises: a probe that includes a cantilever and a tip whose length corresponds to a depth of a trench that is formed in a wafer; a trench detector that acquires location information of the trench using the probe, where the location information includes depth information of the trench; a controller that inserts the tip into a first point where there exists a trench based on the location information of the trench, and moves the tip through the trench using the location information of the trench; and a defect detector that detects a presence of a defect in a sidewall of the trench as the tip is moved through the trench.