公开(公告)号：US11921554B2

公开(公告)日：2024-03-05

申请号：US17718699

申请日：2022-04-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong-Lae Park ,  Bumgyu Park ,  Hanjun Shin ,  Daeyeong Lee ,  Choonghoon Park ,  Dahye Choi ,  Donghee Han

IPC: G06F1/20 ,  G06F1/03 ,  G06F1/324 ,  G06F1/3296

CPC classification number: G06F1/206 ,  G06F1/03 ,  G06F1/324 ,  G06F1/3296

Abstract: Disclosed is an apparatus for dynamic thermal management, which includes a thermal management unit that determines whether there is a need to perform thermal management on a processor based on temperatures measured from a plurality of temperature sensors included in the processor and generates an indication signal, and a controller that performs the thermal management on the processor in response to the indication signal, by using a first method of adjusting a state of each of a plurality of cores included in the processor, a second method of adjusting a level of an operating voltage and a frequency of a clock signal, which are provided to the processor, and/or a third method for adjusting only the frequency of the clock signal to be provided to the processor, and where each of the plurality of cores is in a wake-up state or an idle state.