公开(公告)号：US20180158241A1

公开(公告)日：2018-06-07

申请号：US15687605

申请日：2017-08-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JE-HYUN LEE ,  SUNG-HWAN JANG ,  SUNG-YOUN CHUNG ,  JAE-HOON JEONG

IPC: G06T17/20 ,  G06K9/62 ,  G06K9/00

CPC classification number: G06T17/205 ,  G06K9/00201 ,  G06K9/40 ,  G06K9/6267 ,  G06T19/20 ,  G06T2219/2021

Abstract: To reduce structure noise, input data representing an input structure is obtained and boundary conditions are set by classifying data of each of multiple structure elements of the input data as a signal component or a noise component. A smoothing operation is performed with respect to the input data and based on the boundary conditions. Output data representing an output structure is provided by reducing noise from the input structure.

公开(公告)号：US20190229023A1

公开(公告)日：2019-07-25

申请号：US16236761

申请日：2018-12-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SUNG-BO SHIM ,  JE-HYUN LEE

IPC: H01L21/66 ,  G01B15/00

Abstract: A wafer measurement system for measuring a measurable characteristic of a first measurement target formed on a wafer includes: a memory and a processor. The memory is configured to store an image of the wafer, multiple templates each including at least one line, and a measurement program. The processor is accessible to the memory and is configured to execute multiple modules included in the measurement program. The modules include: a template selection module configured to receive the templates and select a measurement template corresponding to a shape of the first measurement target; a template matching module configured to match the measurement template to the first measurement target; and a measurement module configured to measure the measurable characteristic of the first measurement target based on position information of the measurement template.