公开(公告)号：US20240324132A1

公开(公告)日：2024-09-26

申请号：US18731991

申请日：2024-06-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoonhee LEE ,  Juncheol SHIN ,  Aeree KIM ,  Joungki PARK ,  Seungchang BAEK ,  Junghyun IM ,  Jinhwan JEONG ,  Sungho CHO ,  Hangyu HWANG

IPC: H05K5/04

CPC classification number: H05K5/04

Abstract: An electronic device housing and an electronic device including the same are provided. An electronic device housing includes a metal substrate, a plastic injection part formed on one area on a surface of the metal substrate, an oxide film layer formed on one area on the surface of the metal substrate, a plating layer formed on one area on the surface of the metal substrate, and a deposition layer formed on the plating layer, wherein the oxide film layer and the plating layer may be formed to be apart from each other.

公开(公告)号：US20220418135A1

公开(公告)日：2022-12-29

申请号：US17847871

申请日：2022-06-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoonhee LEE ,  Youngoh KIM ,  Juncheol SHIN ,  Seungchang BAEK ,  Sungho CHO ,  Hangyu HWANG

IPC: H05K5/04

Abstract: A housing of an electronic device includes two or more metal portions, each having an oxide film layer formed on a surface thereof, and a non-conductive portion formed to cover at least a portion of the oxide film layer.

公开(公告)号：US20220400569A1

公开(公告)日：2022-12-15

申请号：US17811402

申请日：2022-07-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoonhee LEE ,  Juncheol SHIN ,  Hangyu HWANG ,  Yucheol KIM ,  Jungmin YEO

IPC: H05K5/04 ,  C25D21/00 ,  C25D11/24

Abstract: Disclosed are an electronic device including a housing having a matte surface and a method of manufacturing the same. An electronic device according to various embodiments of the disclosure is an electronic device including a housing. The housing may include a base material including an aluminum alloy, a plurality of pits adjacently formed on a surface of the base material, and a crystal grain boundary protrusion part formed as a crystal grain boundary of the surface of the base material portion protrudes on the surface. A method of manufacturing a housing for an electronic device may include an etching step of generating irregularities on a surface of a base material including an aluminum alloy in a way to etch the base material by dipping the base material into an etching solution containing chloride ions, and an anodizing step of forming an anodizing layer on the surface of the base material by dipping, into an anodizing solution, the base material on which the etching step has been completed and applying a current to the base material by using the base material as an anode.