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    ELECTRONIC DEVICE INCLUDING CONDUCTIVE KEY BUTTON
    2.
    发明公开
    ELECTRONIC DEVICE INCLUDING CONDUCTIVE KEY BUTTON 审中-公开

    公开(公告)号：US20230367367A1

    公开(公告)日：2023-11-16

    申请号：US18172667

    申请日：2023-02-22

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Youngsoo HA ,  Yoonhee LEE ,  Hangyu HWANG

    IPC: G06F1/16 ,  G06F3/02 ,  G06V40/13 ,  G06V10/10 ,  G06F3/01

    CPC classification number: G06F1/163 ,  G06F3/02 ,  G06V40/1329 ,  G06V10/17 ,  G06F3/011

    Abstract: According to an embodiment, an electronic device includes a housing providing an inner space, a sensor disposed in the inner space, and a key button including an electrode electrically connected to the sensor and configured to obtain biometric information through a contact with an external object through the sensor, wherein the key button includes a metal layer, a deposited layer including a hole connected to a part of the metal layer and disposed on the metal layer, and a conductive material disposed in the hole and contact with the metal layer exposed through the hole, wherein a diameter of one side of the hole facing an outside is greater than a thickness of the deposited layer.

    ELECTRONIC DEVICE HAVING HOUSING COMPRISING METAL MATERIAL
    4.
    发明申请
    ELECTRONIC DEVICE HAVING HOUSING COMPRISING METAL MATERIAL 有权

    公开(公告)号：US20230121011A1

    公开(公告)日：2023-04-20

    申请号：US18086895

    申请日：2022-12-22

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sangin BAEK ,  Daum HWANG ,  Yoonhee LEE

    IPC: H05K5/02 ,  H05K5/03 ,  H04M1/02 ,  G06F1/16

    Abstract: An electronic device according to an embodiment may include cover glass and a housing on which the cover glass is seated. The housing includes a metal frame comprising a metal material, and on the metal frame, a seating surface for mounting the cover glass may be formed. The metal frame may include: a first region forming at least a portion of a side surface of the electronic device; and a second region to which the cover glass is attached, wherein an anodizing layer including nickel (Ni) may be arranged in the first region, and an anodizing layer that does not include nickel may be arranged in the second region.

    ELECTRONIC DEVICE INCLUDING CONDUCTIVE CONNECTION MEMBER
    6.
    发明公开
    ELECTRONIC DEVICE INCLUDING CONDUCTIVE CONNECTION MEMBER 审中-公开

    公开(公告)号：US20230141690A1

    公开(公告)日：2023-05-11

    申请号：US17894543

    申请日：2022-08-24

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Seungchang BAEK ,  Hyeongsam SON ,  Changhyeok SHIN ,  Yoonhee LEE ,  Junghyun IM ,  Sungho CHO ,  Jungwoo CHOI ,  Hangyu HWANG ,  Minwoo YOO

    IPC: H05K5/02

    CPC classification number: H05K5/0217 ,  H05K5/0247 ,  H05K5/0018

    Abstract: An electronic device is provided. The electronic device includes a display, a frame structure including a first conductive member defining an external appearance of the electronic device and operated as an antenna element of the electronic device, a second conductive member coupled and electrically connected to the first conductive member, and a nonconductive member that supports the display together with the second conductive member, a bonding layer including a first layer at least partially disposed between the first conductive member and the nonconductive member, and a second layer at least partially disposed between the second conductive member and the nonconductive member, and at least one conductive connection member disposed at a portion, at which the first conductive member and the second conductive member are coupled to each other, and contacting the first conductive member and the second conductive member.

    ELECTRONIC DEVICE HAVING HOUSING HAVING MATT SURFACE AND METHOD OF PRODUCING THE SAME
    7.
    发明申请
    ELECTRONIC DEVICE HAVING HOUSING HAVING MATT SURFACE AND METHOD OF PRODUCING THE SAME 有权

    公开(公告)号：US20220400569A1

    公开(公告)日：2022-12-15

    申请号：US17811402

    申请日：2022-07-08

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yoonhee LEE ,  Juncheol SHIN ,  Hangyu HWANG ,  Yucheol KIM ,  Jungmin YEO

    IPC: H05K5/04 ,  C25D21/00 ,  C25D11/24

    Abstract: Disclosed are an electronic device including a housing having a matte surface and a method of manufacturing the same. An electronic device according to various embodiments of the disclosure is an electronic device including a housing. The housing may include a base material including an aluminum alloy, a plurality of pits adjacently formed on a surface of the base material, and a crystal grain boundary protrusion part formed as a crystal grain boundary of the surface of the base material portion protrudes on the surface. A method of manufacturing a housing for an electronic device may include an etching step of generating irregularities on a surface of a base material including an aluminum alloy in a way to etch the base material by dipping the base material into an etching solution containing chloride ions, and an anodizing step of forming an anodizing layer on the surface of the base material by dipping, into an anodizing solution, the base material on which the etching step has been completed and applying a current to the base material by using the base material as an anode.

    ELECTRONIC DEVICE INCLUDING METAL MEMBER
    9.
    发明公开
    ELECTRONIC DEVICE INCLUDING METAL MEMBER 审中-公开

    公开(公告)号：US20230216942A1

    公开(公告)日：2023-07-06

    申请号：US18120021

    申请日：2023-03-10

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Junghyun IM ,  Joungki PARK ,  Jinwoo PARK ,  Seungchang BAEK ,  Yoonhee LEE ,  Jungwoo CHOI ,  Sungho CHO ,  Hangyu HWANG ,  Jongchul CHOI

    IPC: H04M1/02

    CPC classification number: H04M1/0249 ,  H04M1/0274 ,  H04M1/0277

    Abstract: An electronic device according to an embodiment may include a housing comprising: an outer portion defining at least a portion of an exterior of the electronic device and comprising a first conductive material, an inner portion comprising a second conductive material having a first melting point different from that of the first conductive material and at least partially defining a space for receiving multiple electronic components arranged inside the electronic device, and a middle portion comprising a third conductive material having a second melting point and an injection molded insulator, wherein the third conductive material of the middle portion and the first conductive material of the outer portion are coupled to form a concave-convex structure, a difference between the first melting point and the second melting point is in a first range, and the third conductive material of the middle portion is electrically connected to the second conductive material of the inner portion.

    ELECTRONIC DEVICE INCLUDING METAL HOUSING
    10.
    发明申请
    ELECTRONIC DEVICE INCLUDING METAL HOUSING 有权

    公开(公告)号：US20220312613A1

    公开(公告)日：2022-09-29

    申请号：US17701064

    申请日：2022-03-22

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jongsu LEE ,  Yoonhee LEE ,  Kiseok KWON ,  Sungho CHO

    IPC: H05K5/04 ,  H04B1/3888 ,  C25D11/12 ,  C25D21/12

    Abstract: An electronic device is provided. The electronic device includes a housing that forms a portion of an outer surface of the electronic device and a display disposed in the housing and visually exposed through one side of the housing. The housing includes a first portion containing a metallic material, and the first portion includes a base material layer made of the metallic material, a first film layer that is disposed adjacent to a surface of the housing and that contains oxide of the metallic material, and a second film layer that is disposed between the base material layer and the first film layer and that contains oxide of the metallic material. The first film layer includes a first pore structure that extends in a direction substantially perpendicular to a surface of the first film layer, and the second film layer includes a second pore structure that is at least partially in fluid communication with the first pore structure and that extends in a radial shape toward the base material layer.

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