-
1.发明申请公开(公告)号：US20220418135A1
公开(公告)日：2022-12-29
申请号：US17847871
申请日：2022-06-23
发明人： Yoonhee LEE , Youngoh KIM , Juncheol SHIN , Seungchang BAEK , Sungho CHO , Hangyu HWANG
IPC分类号： H05K5/04
摘要： A housing of an electronic device includes two or more metal portions, each having an oxide film layer formed on a surface thereof, and a non-conductive portion formed to cover at least a portion of the oxide film layer.
-
公开(公告)号：US20220312613A1
公开(公告)日：2022-09-29
申请号：US17701064
申请日：2022-03-22
发明人： Jongsu LEE , Yoonhee LEE , Kiseok KWON , Sungho CHO
IPC分类号： H05K5/04 , H04B1/3888 , C25D11/12 , C25D21/12
摘要： An electronic device is provided. The electronic device includes a housing that forms a portion of an outer surface of the electronic device and a display disposed in the housing and visually exposed through one side of the housing. The housing includes a first portion containing a metallic material, and the first portion includes a base material layer made of the metallic material, a first film layer that is disposed adjacent to a surface of the housing and that contains oxide of the metallic material, and a second film layer that is disposed between the base material layer and the first film layer and that contains oxide of the metallic material. The first film layer includes a first pore structure that extends in a direction substantially perpendicular to a surface of the first film layer, and the second film layer includes a second pore structure that is at least partially in fluid communication with the first pore structure and that extends in a radial shape toward the base material layer.
-
公开(公告)号：US20220248551A1
公开(公告)日：2022-08-04
申请号：US17590039
申请日：2022-02-01
发明人： Yoonhee LEE , Hangyu HWANG , Junghyun IM
摘要： Various embodiments of the present disclosure relate to an electronic device including a housing and a method of manufacturing the housing. The electronic device includes a housing forming an exterior of the electronic device. The housing is constituted to include a non-conductive part including a non-conductive protrusion protruded from at least some area of the non-conductive part, a conductive deposition layer disposed on a top surface of the non-conductive part except on the non-conductive protrusion, and a decoration layer formed on the top of the conductive deposition layer. Accordingly, the housing is lightweight and can perform a function of an antenna radiator. Other various embodiments are possible.
-
公开(公告)号：US20210095388A1
公开(公告)日：2021-04-01
申请号：US15733235
申请日：2019-01-08
发明人： Yoonhee LEE , Sungho CHO , Minwoo YOO
摘要： A portable communication device according to various embodiments includes a housing that forms at least a portion of an external surface of the portable communication device, wherein at least a portion of an area of the housing comprises: an aluminum alloy substrate including 90.0 to 99.8 weight % (wt %) of aluminum (Al) and 0.2 to 1.0 wt % of manganese (Mn); and an anodized layer including aluminum oxide (Al2O3) formed on the aluminum alloy substrate, wherein the anodized layer has a first hole and a second hole formed in the anodization layer, wherein the anodized layer may comprise: a plurality of holes including a first hole and a second hole, formed in the anodized layer; a plurality of first channels extending from at least a portion of a surface of the anodized layer to the first hole in a first direction substantially perpendicular thereto, a second channel extending from the first hole toward the aluminum alloy substrate in a second direction different from the first direction, and a third channel extending from the first hole toward the aluminum alloy substrate in a third direction different from the first direction and the second direction. Other embodiments are possible.
-
公开(公告)号：US20220400569A1
公开(公告)日：2022-12-15
申请号：US17811402
申请日：2022-07-08
发明人： Yoonhee LEE , Juncheol SHIN , Hangyu HWANG , Yucheol KIM , Jungmin YEO
摘要： Disclosed are an electronic device including a housing having a matte surface and a method of manufacturing the same. An electronic device according to various embodiments of the disclosure is an electronic device including a housing. The housing may include a base material including an aluminum alloy, a plurality of pits adjacently formed on a surface of the base material, and a crystal grain boundary protrusion part formed as a crystal grain boundary of the surface of the base material portion protrudes on the surface. A method of manufacturing a housing for an electronic device may include an etching step of generating irregularities on a surface of a base material including an aluminum alloy in a way to etch the base material by dipping the base material into an etching solution containing chloride ions, and an anodizing step of forming an anodizing layer on the surface of the base material by dipping, into an anodizing solution, the base material on which the etching step has been completed and applying a current to the base material by using the base material as an anode.
-
公开(公告)号：US20230121011A1
公开(公告)日：2023-04-20
申请号：US18086895
申请日：2022-12-22
发明人： Sangin BAEK , Daum HWANG , Yoonhee LEE
摘要： An electronic device according to an embodiment may include cover glass and a housing on which the cover glass is seated. The housing includes a metal frame comprising a metal material, and on the metal frame, a seating surface for mounting the cover glass may be formed. The metal frame may include: a first region forming at least a portion of a side surface of the electronic device; and a second region to which the cover glass is attached, wherein an anodizing layer including nickel (Ni) may be arranged in the first region, and an anodizing layer that does not include nickel may be arranged in the second region.
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.033 秒)