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公开(公告)号:US20240324132A1
公开(公告)日:2024-09-26
申请号:US18731991
申请日:2024-06-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yoonhee LEE , Juncheol SHIN , Aeree KIM , Joungki PARK , Seungchang BAEK , Junghyun IM , Jinhwan JEONG , Sungho CHO , Hangyu HWANG
IPC: H05K5/04
CPC classification number: H05K5/04
Abstract: An electronic device housing and an electronic device including the same are provided. An electronic device housing includes a metal substrate, a plastic injection part formed on one area on a surface of the metal substrate, an oxide film layer formed on one area on the surface of the metal substrate, a plating layer formed on one area on the surface of the metal substrate, and a deposition layer formed on the plating layer, wherein the oxide film layer and the plating layer may be formed to be apart from each other.
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公开(公告)号:US20230216942A1
公开(公告)日:2023-07-06
申请号:US18120021
申请日:2023-03-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junghyun IM , Joungki PARK , Jinwoo PARK , Seungchang BAEK , Yoonhee LEE , Jungwoo CHOI , Sungho CHO , Hangyu HWANG , Jongchul CHOI
IPC: H04M1/02
CPC classification number: H04M1/0249 , H04M1/0274 , H04M1/0277
Abstract: An electronic device according to an embodiment may include a housing comprising: an outer portion defining at least a portion of an exterior of the electronic device and comprising a first conductive material, an inner portion comprising a second conductive material having a first melting point different from that of the first conductive material and at least partially defining a space for receiving multiple electronic components arranged inside the electronic device, and a middle portion comprising a third conductive material having a second melting point and an injection molded insulator, wherein the third conductive material of the middle portion and the first conductive material of the outer portion are coupled to form a concave-convex structure, a difference between the first melting point and the second melting point is in a first range, and the third conductive material of the middle portion is electrically connected to the second conductive material of the inner portion.
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