公开(公告)号：US11984642B2

公开(公告)日：2024-05-14

申请号：US17436479

申请日：2019-12-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonjae Lee ,  Minsoo Kim ,  Hyuntae Jung ,  Kiman Kim ,  Jiwoo Lee

IPC: H05K1/02 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q1/42 ,  H01Q1/44 ,  H01Q1/48 ,  H01Q1/52 ,  H01Q5/321 ,  H01Q5/335 ,  H01Q5/364 ,  H01Q5/378 ,  H01Q5/40 ,  H01Q9/42 ,  H04M1/02 ,  H04M1/26 ,  H04M1/272 ,  H05K1/18 ,  H05K5/04

CPC classification number: H01Q1/243 ,  H04M1/0249 ,  H04M1/0277 ,  H05K1/181

Abstract: According to various embodiments, an electronic apparatus comprises: a housing including a front plate, a rear plate disposed facing a direction opposite the front plate, and a side bezel enclosing at least a portion of the space between the front plate and the rear plate; a circuit board disposed between the front plate and the rear plate; a first radiating conductor disposed to form at least a portion of the side bezel; a connection member comprising a conductive material disposed between the circuit board and the rear plate; and a processor or communication module comprising communication circuitry disposed on the circuit board. The connection member includes a first curved part provided on one end and contacting the circuit board, and a second curved part provided on another end and contacting the first radiating conductor, thereby electrically connecting the first radiating conductor to the circuit board. The processor or communication module can be configured to use the first radiating conductor to perform wireless communication in at least one frequency band.