Electronic device including wireless charging structure

    公开(公告)号:US11670963B2

    公开(公告)日:2023-06-06

    申请号:US16852884

    申请日:2020-04-20

    摘要: An electronic device is provided. The electronic device includes a housing including a front plate that faces a first direction and a rear plate that faces a second direction, which is opposite the first direction, a display panel configured to output a screen through the front plate, a bracket disposed between the display panel and the rear plate, the bracket being configured to support internal components, a flexible printed circuit board including a first area electrically connected to the display panel, and a second area extending from the first area and disposed between the display panel and the bracket, a wireless charging structure disposed on one face of the second area or inside the second area, the wireless charging structure including a coil portion and transmission wires electrically connected to the coil portion, and a magnetic plate disposed between the bracket and the flexible printed circuit board, and at least one area of the magnetic plate being disposed to face the wireless charging structure.

    Electronic device including capacitive structure

    公开(公告)号:US10477675B1

    公开(公告)日:2019-11-12

    申请号:US16377582

    申请日:2019-04-08

    摘要: Various embodiments of the disclosure relate to an electronic device including a capacitive structure. The electronic device may include: a housing including a first plate, a second plate facing a direction opposite the first plate, and a side member comprising a side wall surrounding a space between the first plate and the second plate, the side member including a conductive portion; a conductive mid-plate disposed in the housing parallel to the second plate; a dielectric gap formed between the conductive portion and the conductive mid-plate; a printed circuit board (PCB) disposed inside the housing between the conductive mid-plate and the second plate, the PCB including a ground plane; and a capacitive structure comprising a conductive material disposed at a boundary portion of the dielectric gap and the conductive mid-plate between the conductive mid-plate and the PCB, the capacitive structure including a first conductive layer connected to the conductive mid-plate, a second conductive layer spaced apart from the first conductive layer and electrically connected to the ground plane, and a dielectric layer interposed between the first conductive layer and the second conductive layer.