公开(公告)号：US20240234274A1

公开(公告)日：2024-07-11

申请号：US18372257

申请日：2023-09-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tong Suk KIM ,  Sang Woong LEE ,  Shle-Ge LEE ,  Seung Soo HA ,  Chang Ui HONG

IPC: H01L23/498 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L23/49816 ,  H01L23/49838 ,  H01L25/0655 ,  H01L25/105 ,  H01L24/16 ,  H01L2224/16225

Abstract: A semiconductor package, including a first structure including a ball array region on a lower surface of the first structure and an external region completely surrounding the ball array region, the ball array region including a passive element region in which solder balls are not disposed and an edge region completely surrounding the passive element region, a first semiconductor chip on an upper surface of the first structure, a passive element in the passive element region on the lower surface of the first structure, the passive element not in the edge region on the lower surface of the first structure, and a first ball array in the edge region on the lower surface of the first structure, the first ball array including two or more first power solder balls supplying power to at least one of the passive element and the first semiconductor chip.