公开(公告)号：US20250128215A1

公开(公告)日：2025-04-24

申请号：US18639634

申请日：2024-04-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myeongjun GIL ,  Sunghyup KIM ,  Sebin CHOI

IPC: B01F25/314 ,  B01F23/10 ,  B01F25/31 ,  B01F101/58

Abstract: A gas mixer may include a first gas channel, a first distribution channel, a second gas channel and a plurality of first connection channels. The first gas channel may be configured to supply a first gas into a reaction chamber. The first distribution channel may surround the first gas channel and is configured to uniformly distribute a second gas within the first distribution channel. The second gas channel may be configured to supply the second gas into the first distribution channel. The plurality of the first connection channels may be connected between the first distribution channel and the first gas channel. Thus, the second gas may be uniformly distributed in the cylindrical first distribution channel. The second gas may then be supplied to the first gas channel through the first connection channels. The second gas may be mixed with the first gas to form a mixed gas. As a result, the mixed gas may be uniformly distributed in the reaction chamber.

公开(公告)号：US20230238351A1

公开(公告)日：2023-07-27

申请号：US18128449

申请日：2023-03-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonggu LEE ,  Sunghyup KIM ,  Byungjo KIM ,  Sanghoon LEE ,  Sukwon LEE ,  Sebin CHOI

IPC: H01L23/00 ,  B29C65/30 ,  B29C65/00

CPC classification number: H01L24/75 ,  B29C65/30 ,  B29C66/8185 ,  H01L2224/75502 ,  H01L2224/75745 ,  H01L2224/75252 ,  H01L2224/75984

Abstract: A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.

公开(公告)号：US20210098415A1

公开(公告)日：2021-04-01

申请号：US16837025

申请日：2020-04-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonggu LEE ,  Sunghyup KIM ,  Byungjo KIM ,  Sanghoon LEE ,  Sukwon LEE ,  Sebin CHOI

IPC: H01L23/00 ,  B29C65/30 ,  B29C65/00

Abstract: A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.

公开(公告)号：US20210069811A1

公开(公告)日：2021-03-11

申请号：US16807466

申请日：2020-03-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sebin CHOI ,  Sunghyup Kim ,  Sukwon Lee ,  Jonggu Lee

IPC: B23K1/00 ,  H01L23/00

Abstract: Provided a semiconductor chip bonding apparatus including a body, a heater disposed on a lower surface of the body, a collet disposed on a lower surface of the heater, and a head disposed on a lower surface of the collet, the head has a rectangular plate shape, a lower surface and side surfaces of the head are exposed, an upper surface of the head is in contact with the lower surface of the collet, an area of the upper surface of the head is smaller than an area of the lower surface of the collet, the head includes a central section including a recess, and an outer surface constituting a part of the side surfaces of the head, and a peripheral section connected to the recess and disposed on each corners of the head, and a thermal conductivity of the peripheral section is different from that of the central section.