公开(公告)号：US20170155746A1

公开(公告)日：2017-06-01

申请号：US15287900

申请日：2016-10-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hae-Jung YANG ,  Seung-Joo LEE ,  Kwang-Eun GO ,  Kang-Sik KIM ,  Jae-Hoon WOO ,  Jong-Min LEE

IPC: H04M1/02 ,  H05K9/00 ,  H05K7/20

CPC classification number: H04M1/026 ,  G06F1/1637 ,  G06F1/203 ,  H04M1/0266 ,  H04M1/0277 ,  H04M1/0279 ,  H05K7/20509 ,  H05K9/0007

Abstract: A method for manufacturing an electronic device, according to the present disclosure, may include: detecting positions of one or more heat sources, which are disposed in a printed circuit board or in a display of the electronic device, or a path of the heat that is diffused from the heat sources; selecting a heat radiating structure to correspond to the positions of the heat sources or the diffusion path; selecting an adiabatic member or a heat radiating member, which is disposed based the selected heat radiating structure to block or radiate the heat transferred from the heat source; and forming the selected heat radiating structure or disposing the selected adiabatic member or heat radiating member on the periphery of the heat source or on the diffusion path. According to various embodiments of the disclosure, the heat radiation improvement can be maximized and/or improved by improving the structure of a heat radiation path of the electronic device and by selecting and disposing heat radiating members in appropriate positions.