公开(公告)号：US20190200490A1

公开(公告)日：2019-06-27

申请号：US16290448

申请日：2019-03-01

申请人： INTEL CORPORATION

发明人： Robert Sankman

IPC分类号： H05K9/00 ,  H01L23/552

CPC分类号： H05K9/0007 ,  H01L23/552 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K9/006 ,  H05K9/0086

摘要： Disclosed are EMI shielded packages, electronic device packages, and related methods. EMI shielded packages are formed by applying an insulating material to a first side of a substrate strip, separating the substrate strip into segments, adhering the insulating material of the segments to a solid conductor, applying a conductive paste around lateral sides of the segments, curing the conductive paste, and cutting through the conductive paste and the solid conductor to form the EMI packages. An electronic device package includes a substrate including electronic circuitry, an EMI shield, and an insulating material insulating the substrate from the EMI shield. The EMI shield includes a solid conductor adhered to the insulating material, and a cured conductive paste at least partially surrounding a lateral edge of the substrate. The cured conductive paste electrically connects the solid conductor to a conductive terminal in a lateral side of the substrate.

公开(公告)号：US20180358759A1

公开(公告)日：2018-12-13

申请号：US15995095

申请日：2018-05-31

申请人： YAZAKI CORPORATION

发明人： Takahiko Sato ,  Takashi Sone

IPC分类号： H01R13/6593 ,  H05K9/00 ,  H01R13/74 ,  H01R13/502 ,  H01R13/6582

CPC分类号： H01R13/6593 ,  H01R4/18 ,  H01R4/646 ,  H01R13/502 ,  H01R13/516 ,  H01R13/6582 ,  H01R13/6596 ,  H01R13/73 ,  H01R13/74 ,  H05K9/0007 ,  H05K9/0018

摘要： A shield shell includes a housing accommodation portion and a shield member mounting portion. The shield member mounting portion is formed to be continuous to the housing accommodation portion. A shield member fixing part is provided on an outer surface of the shield member mounting portion. The shield member fixing part has an inclined shape in which a cross-section taken along an axial direction of the shield member mounting portion expands outwards from a base end side of the shield member mounting portion toward an open end side of the shield member mounting portion.

公开(公告)号：US20180233263A1

公开(公告)日：2018-08-16

申请号：US15750535

申请日：2016-07-20

申请人： AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

发明人： Yoshio Mizutani

IPC分类号： H01F17/06 ,  H02G3/30 ,  H05K9/00 ,  H01F27/24

CPC分类号： H01F17/06 ,  H01F27/24 ,  H02G3/30 ,  H05K9/0007

摘要： An aligned state of core sections is reliably maintained. A fixing structure for a cylindrical magnetic core including an insertion hole into which an electric wire is inserted with a plurality of core sections, which are divided in a circumferential direction, being coaxially aligned with each other, includes a clamping band to be wound around outer circumferential faces of the core sections to tighten the core sections. The magnetic core is accommodated in a holder, and the holder has a holder-side locking-receiving portion at which a remaining portion of the clamping band is locked. Meanwhile, an electric wire fixing portion that is fixed to the electric wire, which passes through the magnetic core, is formed in the holder.

公开(公告)号：US20180220539A1

公开(公告)日：2018-08-02

申请号：US15747569

申请日：2016-08-05

申请人： Hitachi Automotive Systems, Ltd.

发明人： Yujiro KANEKO ,  Yoshio KAWAI

IPC分类号： H05K5/00 ,  B60R16/02 ,  H05K1/18 ,  H05K5/06 ,  H05K7/20 ,  H05K9/00 ,  H05K1/02 ,  H05K3/28

CPC分类号： H05K5/0017 ,  B60R16/02 ,  H01L23/29 ,  H05K1/0203 ,  H05K1/0216 ,  H05K1/181 ,  H05K3/28 ,  H05K3/284 ,  H05K5/00 ,  H05K5/0034 ,  H05K5/065 ,  H05K7/14 ,  H05K7/20 ,  H05K7/20409 ,  H05K7/20854 ,  H05K7/209 ,  H05K9/00 ,  H05K9/0007 ,  H05K9/0084 ,  H05K2201/10075 ,  H05K2201/10371 ,  H05K2201/10522 ,  H05K2203/1316 ,  H05K2203/1327

摘要： Providing an electronic control device excellent in electromagnetic shielding property with low cost. An electronic control device includes: an electronic component; a control substrate on which the electronic component is mounted; a sealing resin that seals the control substrate; and a metal housing case at least a portion of which is sealed with the sealing resin. The housing case consists of: a heat sink portion a portion of which is exposed from the sealing resin to dissipate heat of the inside of the sealing resin; an electromagnetic shield unit that shields electromagnetic noise by covering the electronic component; and a fixing portion exposed from the sealing resin to achieve fixation to a vehicle body.

公开(公告)号：US20180162547A1

公开(公告)日：2018-06-14

申请号：US15375229

申请日：2016-12-12

申请人： UNITED TECHNOLOGIES CORPORATION

发明人： Wayde R. Schmidt

IPC分类号： B64D45/00 ,  B05D1/04 ,  B05D5/00 ,  B05D3/12 ,  B05D3/04 ,  H05K9/00

CPC分类号： B64D45/00 ,  B05D1/04 ,  B05D3/0473 ,  B05D3/12 ,  B05D5/00 ,  B64D45/02 ,  B82Y30/00 ,  C04B35/62227 ,  C04B35/62281 ,  C04B2235/327 ,  C04B2235/3272 ,  C04B2235/40 ,  C04B2235/405 ,  C04B2235/48 ,  C04B2235/483 ,  C04B2235/5264 ,  D01D5/0007 ,  D01F1/09 ,  D01F1/10 ,  D01F9/00 ,  H05K9/0007 ,  H05K9/0081

摘要： A method of forming a protective shield to protect an aircraft component from EMI or energy bursts includes the steps of combining a carbon-based or silicon-based preceramic polymer precursor and a metallic precursor to form a dope, processing the dope to provide a deposit that includes nano-structures, post-processing the deposit to provide a nano-structure material with a uniformly distributed base metal or metal compound, and forming a protective shield using the nano-structure material.

公开(公告)号：US20180027707A1

公开(公告)日：2018-01-25

申请号：US15642892

申请日：2017-07-06

申请人： FUJITSU LIMITED

发明人： Yoshiaki Hiratsuka ,  Kai Nojima ,  Kenji NAGASE ,  Yoshinori MESAKI

IPC分类号： H04B3/28 ,  H05K5/03 ,  H05K9/00 ,  H05K5/00

CPC分类号： H05K9/0049 ,  H05K5/0008 ,  H05K5/03 ,  H05K9/0007

摘要： A housing includes a first member that has a first conductor, a second member that has a second conductor and cooperates with the first member to accommodate a circuit board on which an electronic element is mounted, inside a space surrounded by the first conductor and the second conductor, and a plurality of connecting elements that are arranged at a predetermined arrangement interval y to fix the second member to the first member.

公开(公告)号：US20180026325A1

公开(公告)日：2018-01-25

申请号：US15215982

申请日：2016-07-21

申请人： Hewlett Packard Enterprise Development LP

发明人： Elene Chobanyan ,  Karl J. Bois ,  Dave Mayer ,  Arlen L. Roesner

IPC分类号： H01P3/127 ,  H01P1/30 ,  H01P3/12 ,  H05K9/00

CPC分类号： H05K9/0007 ,  H01P1/30 ,  H01P5/024 ,  H05K9/0041

摘要： Examples described herein include an electromagnetic interference shield. In some examples, the electromagnetic interference shield includes a wall comprised of a conductive material. The wall may have a first surface, a second surface, and a thickness between the first surface and the second surface. The shield may include a rounded opening in the wall that creates an air passageway through the thickness of the wall. The shield may also include a first obstruction in the opening and a second obstruction in the opening. The first obstruction may span across the opening. The second obstruction may span across the opening and intersect the first obstruction. The first obstruction and the second obstruction may be waveguide structures.

公开(公告)号：US09861017B2

公开(公告)日：2018-01-02

申请号：US14370834

申请日：2012-01-16

申请人： Frank Borngräber

发明人： Frank Borngräber

IPC分类号： H05K9/00 ,  H01F38/14 ,  H02J7/02 ,  H02J5/00

CPC分类号： H05K9/0007 ,  H01F38/14 ,  H02J5/005 ,  H02J7/025 ,  H02J50/10 ,  H02J50/70

摘要： The invention relates to protecting metals and components from inductive energy. The protecting apparatus comprises an inductive energy coil (51), a first shielding unit comprising an opening (58) around the inductive energy coil (51) wherein the first shielding unit (54) is located in parallel to inductive energy coil (51); and a second shielding unit (53) under the inductive energy coil (51) so that the inductive energy coil (51) is enabled for electromagnetic radiation. The invention further relates to a method for producing the protecting apparatus and an electronic device comprising the protecting apparatus.

公开(公告)号：US09823718B2

公开(公告)日：2017-11-21

申请号：US14995034

申请日：2016-01-13

申请人： Microsoft Technology Licensing, LLC

发明人： David Platt ,  Andrew Delano ,  Todd Pleake

IPC分类号： H05K7/20 ,  G06F1/20 ,  H05K9/00

CPC分类号： G06F1/203 ,  H05K7/20445 ,  H05K9/0007 ,  H05K9/0032

摘要： The description relates to devices, such as computing devices. One example can include a processor secured to a circuit board and a self-biasing heat sink positioned over the processor and secured to the circuit board to complete a Faraday Cage around the processor. The self-biasing heat sink can include a peripheral portion positioned in a first plane and a contact portion positioned in a second different plane and biased against the heat generating component by an interposed biasing portion that is flexed to force the contact portion against the processor.

公开(公告)号：US20170331184A1

公开(公告)日：2017-11-16

申请号：US15595544

申请日：2017-05-15

申请人： Kathrein Werke KG

发明人： Jörg Langenberg ,  Torsten Richter ,  Josef Mayer

IPC分类号： H01Q1/52 ,  H01Q1/22 ,  H01Q1/48 ,  H05K9/00

CPC分类号： H01Q1/526 ,  H01Q1/22 ,  H01Q1/246 ,  H01Q1/48 ,  H05K9/0007 ,  H05K9/006

摘要： What is provided is a shield housing for shielding interconnect structures and/or components disposed on a circuit board, wherein at least two antenna radiators can be disposed on the shield housing, and wherein the shield housing is configured in such a manner that it can cover the interconnect structures and/or components disposed on the circuit board, at least in part, can be connected with a ground surface of the circuit board, and has a region between the antenna radiators, which region is configured in such a manner that it provides electrical decoupling of the feed of the antenna radiators from one another.