公开(公告)号：US20220189835A1

公开(公告)日：2022-06-16

申请号：US17376883

申请日：2021-07-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Choongbin YIM ,  Dongwook KIM ,  Hyunki KIM ,  Jongbo SHIM ,  Jihwang KIM ,  Sungkyu PARK ,  Yongkwan LEE ,  Byoungwook JANG

IPC: H01L23/12 ,  H01L23/538

Abstract: A semiconductor package including a first package substrate, a first semiconductor chip on the first package substrate, a first conductive connector on the first package substrate and laterally spaced apart from the first semiconductor chip, an interposer substrate on the first semiconductor chip and electrically connected to the first package substrate through the first conductive connector, the interposer substrate including a first portion overlapping the first semiconductor chip and a plurality of upper conductive pads in the first portion, a plurality of spacers on a lower surface of the first portion of the interposer substrate and positioned so as not to overlap the plurality of upper conductive pads in a plan view, and an insulating filler between the interposer substrate and the first package substrate may be provided.

公开(公告)号：US20230185822A1

公开(公告)日：2023-06-15

申请号：US17949442

申请日：2022-09-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungmin LEE ,  Myoungwon OH ,  Sungkyu PARK

IPC: G06F16/27

CPC classification number: G06F16/27

Abstract: A distributed storage system includes a plurality of host servers including a primary compute node and backup compute nodes for processing first data having a first identifier, and a plurality of storage nodes that communicates communicate with the plurality of compute nodes, and includes a plurality of storage volumes. The plurality of storage volumes include a primary storage volume and backup storage volumes for storing the first data. The primary compute node provides a replication request for the first data to a primary storage node providing the primary storage volume, when a write request for the first data is received and the primary storage node stores, based on the replication request, the first data in the primary storage volume, copies the first data to the backup storage volumes, and provides, to the primary compute node, a completion acknowledgement to the replication request.

公开(公告)号：US20170094511A1

公开(公告)日：2017-03-30

申请号：US15206536

申请日：2016-07-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Se Jeong NA ,  Donghyoun SON ,  Inseok SHIM ,  Changhoon KIM ,  Sungkyu PARK

IPC: H04W12/06 ,  H04W76/02

CPC classification number: H04W12/06 ,  H04W4/80 ,  H04W76/11 ,  H04W76/14

Abstract: An electronic device comprising: a microphone; a communication circuit; a memory; and at least one processor operatively coupled to the memory, configured to: acquire voice data by using the microphone; identify a user corresponding to the voice data; select an external device based at least in part on an identity of the user; and transmit a connection request to the external device by using the communication circuit.