公开(公告)号：US20250085340A1

公开(公告)日：2025-03-13

申请号：US18667974

申请日：2024-05-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Takuya FAUTATSUYAMA ,  Wandong Kim ,  Kiwhan Song

IPC: G01R31/28 ,  H01L21/66

Abstract: A circuit for detecting defects includes a defect detection conductor provided in a peripheral region of a semiconductor die, an input pad connected to a first end of the defect detection conductor, an output pad connected to a second end of the defect detection conductor, a defect detection assembly connected to the defect detection conductor and configured to detect a defect of the defect detection conductor, and a controller configured to control operations of the defect detection assembly, where the defect detection assembly includes a reference voltage supply, a reference capacitor, a switching assembly, and a plurality of detection capacitors, and the switching assembly is configured to connect the reference capacitor to one of the reference voltage supply, a position adjacent to the input pad of the defect detection conductor, and a position adjacent to the output pad of the defect detection conductor.