公开(公告)号：US20220386465A1

公开(公告)日：2022-12-01

申请号：US17886327

申请日：2022-08-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyeongmin JIN ,  Jichul KIM ,  Yongjae SONG ,  Jaeyeon RA ,  Chagyu SONG

IPC: H05K1/14 ,  H05K1/02

Abstract: Disclosed is a printed circuit board assembly comprising: a first printed circuit board; a second printed circuit board stacked with the first printed circuit board; and an interposer arranged between the first printed circuit board and the second printed circuit board, wherein the second printed circuit board includes a first part and a second part extending in a first direction from a part of the first part and wherein a length of the second part in a second direction perpendicular to the first direction is less than a length in the second direction of the first part, and wherein the direction of a first conductive pattern formed on the first part and the direction of a second conductive pattern formed on the second part are substantially perpendicular to each other.

公开(公告)号：US20250096186A1

公开(公告)日：2025-03-20

申请号：US18970353

申请日：2024-12-05

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Chagyu SONG ,  Hoyeon Seo ,  Jaeyeon Ra ,  Kookjin Park ,  Chulwoo Park ,  Dongjun Shin ,  Jongbum Lee ,  Gyeongmin Jin

IPC: H01L23/00 ,  H01L25/18 ,  H05K1/02 ,  H05K1/18 ,  H10B80/00

Abstract: An electronic device may be provided and include: a printed circuit board includes a first side and a second side perpendicular to the first side; a plurality of solder balls on a surface of the printed circuit board and spaced apart from the first side and the second side; an electronic component including at least one circuit, the electronic component on at least some of the plurality of solder balls; a resin along the first side and filling a portion of a space between the surface of the printed circuit board and the electronic component; and a blocking structure in or on the surface of the printed circuit board, the blocking structure being between the plurality of solder balls and the first side, and extending along the first side such as to separate the at least some of the plurality of solder balls from the resin.