公开(公告)号：US20230133288A1

公开(公告)日：2023-05-04

申请号：US17873385

申请日：2022-07-26

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Junsik PARK ,  Heesu Kim ,  Bonggyu Kang ,  Youngmin Ku ,  Namsu Kim

IPC: G01R31/28 ,  G01R27/26 ,  H05K1/18

Abstract: A semiconductor device includes an internal circuit connected to at least one pad. A first inductor element is connected between the at least one pad and the internal circuit, a second inductor element coupled to the first inductor element and generating an induced voltage due to an overcurrent flowing in the first inductor element. An event detection circuit includes a monitoring element connected to the second inductor element. The monitoring element is configured to generate an event detection signal by sensing changes in properties of the monitoring element caused by at least one of the induced voltages generated in the second inductor element and a current flowing in the second inductor element. The internal circuit supplies an operating voltage to the event detection circuit, and determines whether an event causing the overcurrent has occurred by receiving the event detection signal from the event detection circuit.

公开(公告)号：US20230048277A1

公开(公告)日：2023-02-16

申请号：US17659778

申请日：2022-04-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bonggyu KANG ,  Yongha KIM ,  Youngsoo JANG ,  Heesu KIM ,  Kwangsoo PARK ,  Junsik PARK

IPC: H01L23/60 ,  H01L23/367

Abstract: A semiconductor package includes a package board, at least one semiconductor chip disposed on the package board, a molding member disposed on the package board and at least partially surrounding the at least one semiconductor chip, and a heat dissipation member disposed on the at least one semiconductor chip and the molding member. The molding member has first region in which a plurality of uneven structures are disposed, and a second region spaced apart from an external region by the plurality of uneven structures. The plurality of uneven structures protrude to a predetermined height away from the semiconductor chip, the molding member, and the heat dissipation member, and may be formed as a part of the head dissipation member, or formed separately.

公开(公告)号：US20210274030A1

公开(公告)日：2021-09-02

申请号：US17250323

申请日：2019-04-09

Applicant: Samsung Electronics Co., Ltd. ,  UNITS (ULSAN NATION INSTITUTE OF SCIENCE AND TECHNOLOGY)

Inventor： Jongsung LEE ,  Cheolgu JO ,  Byongsu SEOL ,  Jingook KIM ,  Junsik PARK

IPC: H04M1/02 ,  H05K1/02

Abstract: An electronic device comprises: a first plate configured to face one surface of the electronic device; a second plate configured to face in a direction opposite to the first plate; a side bezel structure connected to the first plate and the second plate and configured to surround the side of the electronic device; and a printed circuit board mounted in the electronic device and configured to be connected to the side bezel structure, wherein the printed circuit board comprises: a ground area; a first conductive pad, disposed in one area of the printed circuit board, and configured to couple the side bezel structure and the printed circuit board; and a second conductive pad electrically connected to the ground area and disposed between the first conductive pad and the ground area, wherein the first conductive pad and the second conductive pad may be disposed at an interval through which a current, having a voltage equal to or greater than a threshold voltage between the first conductive pad and a second electrode, may flow.